2027 HBM talks remain stalled as suppliers push steep price hikes amid AI-driven DRAM crowd-out and tighter capacity.
Driven by surging demand from AI data centers and ultra-high-speed transmission, Cloud Service Providers (CSPs) are actively securing capacity for Electro-absorption Modulated Lasers (EMLs) and Contin...
Geopolitical tension and tight monetary policy keep energy and materials costly, suppressing consumer electronics. Key MLCC inputs remain constrained, while AI servers and data centers drive robust de...
Major US CSPs expand data centers via both build and lease, as construction lags demand, ushering in a dual-track era.
Growth in client SSD contract prices has slowed sharply under multiple market pressures. Surging costs from other component shortages and excess system inventory forced buyers into cautious procuremen...
With mobile DRAM inventory restocking largely completed and demand starting to soften, the urgency of procurement negotiations has diminished, and 3Q26 contract price settlements are likely to be push...
PC DRAM quarterly contract prices continue to rise, though gains have narrowed, leaving buyers and sellers locked in a stalemate. Crowded out by server demand, original manufacturers' future supp...
Green communications leverages nuclear power, liquid cooling, and virtual power plants to overcome energy barriers for 5G and AI, integrating green hydrogen and small reactors for low-carbon power whi...
Global server demand remains solid, sustaining stable Enterprise SSD orders. As suppliers boost production, improved supply has eased urgent order pressures and moderated quarterly contract price incr...
Driven by strong demand from cloud service providers, the demand for HBM and server modules has surged. However, constrained by long equipment lead times and capacity reallocation, supply growth conti...
As global computing power expands, traditional cabling faces severe thermal and power bottlenecks. Emerging Micro LED CPO technology, with its micron-level size and ultra-low power consumption, has be...
Memory supply shifts toward AI servers, squeezing mobile DRAM availability and driving a structural decline in global smartphone output in 2027, with only Huawei bucking the trend.
As AI chips require increasingly stable power delivery, Si‑Cap (silicon capacitors) and their embedded/integrated packaging have become an important technological development direction, and key compan...
DRAM contract prices continue to rise. Driven by tight supply and expectations of negative production growth, manufacturers keep raising quotes. Despite pressure on passing costs to retail, low invent...
AI-driven advanced packaging demand is reshaping the probe card market, boosting margins and triggering a major shift in global supplier rankings.
