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NVIDIA’s Blackwell Ultra to Rename to B300; Stronger Adoption for CoWoS-L GPUs Projected in 2025 to Actuate Expansions of HBM3e 12hi and Liquid-Cooling Solutions
Last Modified
2024-10-03
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TrendForce forecasts that NVIDIA will focus on promoting its Blackwell B300 series AI chips in 2025, with increased adoption of CoWoS-L packaging and liquid cooling solutions. The B300 series will replace Blackwell Ultra, with shipments expected to commence between Q2 and Q3 2025, primarily targeting performance-focused CSP customers and driving the development of HBM3e 12hi memory. Furthermore, NVIDIA will continue to promote its NVL72 Rack solution, further accelerating the adoption of liquid cooling in AI servers. Improvements in CoWoS-L production capacity and yield rates will also contribute to its wider adoption in AI chips.
＜Total Pages：7＞
Category: Semiconductors
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- Selected Topics-TF-0005_NVIDIA’s Blackwell Ultra to Rename to B300; Stronger Adoption for CoWoS-L GPUs Projected in 2025 to Actuate Expansions of HBM3e 12hi and Liquid-Cooling Solutions
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