Hybrid Bonding Technology Portrays Essential Role as Advanced Packaging Continues to Evolve

Last Modified

2023-05-31

Update Frequency

Not

Format

PDF

Summary
The utilization of chiplets paired with 2.5D and 3D advanced packaging technology is bound to become one of the inevitable development trends of high-end chips in order to allow a continuous elevation of computing performance for chips according to the Moore’s Law. With that being said, the existing micro-bump bonding technology that could impede high-end chips from fully exerting their performance would have to be replaced by hybrid bonding. This report analyzes development trends of chiplet design and advanced packaging technology on the one hand, and probes into the necessity and development momentum of the hybrid bonding technology on future development of high-end chips on the other hand.

Tablet of Contents
1. Continuation of Moore’s Law – Chiplet Designs Paired with Advanced Packaging Technology to Become Mainstream

2. Hybrid Bonding Exhibits Significant Advantages over Bump Bonding Pertaining to Chip Stacking

3. Hybrid Bonding Content Expected to Climb Continuously for High-End CIS and CPU Products

4. TRI’s View
(1) High-End Chips Bound to March Towards Multiple Chiplets and Memory Stacking
(2) Essentiality of Hybrid Bonding Continues to Rise among High-End CIS and CPU

＜Total Pages：12＞