Research Reports

SiC/GaN Power Semiconductors Break "AI Power Wall," Reshaping Data Center Power Supply

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2026-04-01

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In 2026, power semiconductors have evolved from conventional components into strategic enablers reshaping the global energy landscape. SiC and GaN technologies are entering a phase of large-scale deployment across global infrastructure as AI data centers confront the “power wall” bottleneck and EVs accelerate the adoption of 800V high-voltage architectures.

Key Highlights

  • Power semiconductors have transformed from conventional components into strategic enablers reshaping the global energy landscape.
  • SiC and GaN technologies are entering large-scale deployment phase across global infrastructure. 
  • AI data centers are confronting the "power wall" bottleneck, driving demand for advanced power solutions.
  • Electric vehicles are accelerating adoption of high-voltage architectures, further boosting power semiconductor requirements. 
  • The convergence of AI infrastructure needs and EV technological advancement is creating unprecedented demand for next-generation power semiconductor technologies. 

Table of Contents

  1. SiC/GaN Evolves from Emerging Technology to Standard Infrastructure for Green Energy and AI Ecosystems
    • Figure 1: Four transformation pathways and the core competitiveness of SiC/GaN
    • Figure 2: Clear division of roles for third-gen semiconductors in AIDC: SiC anchors infrastructure, while GaN targets end-point power conversion
    • Figure 3: SiC as a key enabler in reducing data center OpEx and energy loss
    • Figure 4: Energy efficiency and conversion performance of GaN in power supply units (PSU)
    • Figure 5: Global automaker adoption roadmap for SiC technologies
  2. VIS expands GaN-on-Si product portfolio, opening a new front in power semiconductors
  3. Innoscience enters Tier 1, reshaping the AI power supply chain landscape
  4. STMicroelectronics accelerates market penetration with a “SiC foundation + GaN expansion” strategy
  5. TI builds the core of AI-era power management with an integrated GaN architecture
  6. ROHM builds a global power electronics defense line through in-house GaN production and “Make in India” collaboration
  7. Infineon drives the high-efficiency power revolution with a “SiC core, GaN expansion” strategy
  8. TRI’s View

<Total Pages: 17>

Four Transformation Pathways and Core Competitiveness of SiC/GaN Power Semiconductors





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  • Selected Topics-176_The Convergence of Compute and Power: SiC/GaN Break Through AI “Power Wall” and Redefine High-Voltage Standards New

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