In January 2026, NVIDIA introduced the CMX Context Memory Storage Platform, managed by the BlueField‑4 DPU, to extend the memory hierarchy between local SSD and shared storage and address the massive...
The need for power integrity in AI servers is extending from the board level directly into the package. This shift is driving a transition in capacitor technology, moving beyond a sole reliance on tra...
Beyond full-rack solutions, NVIDIA is also actively promoting its standalone Vera CPU to capture the AI inference market. However, given the LPDRAM supply bottleneck, NVIDIA has decided to reduce the...
Capital shifts to high-performance chips have squeezed mature processes, triggering structural shortages in high-reliability memory. As value revaluation outpaces volume growth, market revenue surges....
On February 16th 2026, MediaTek CEO Rick Tsai stated in his ISSCC 2026 keynote that the basic unit for measuring AI compute efficiency will no longer be just the AI chip, but the entire AI system, inc...
Since 2H25, accelerated AI infrastructure buildouts by CSPs have surged HBM demand and crowded out conventional DRAM capacity, pushing the broader DRAM market into shortage. Constrained by annual pric...
This report first explains why HBM plays a key role in the evolution of LLM and AIGC applications. It then examines the HBM upgrade roadmap and explores how heterogeneous memory integration strategies...
As technical iteration narrows the capability gap between models, Chinese open-source models are expanding their global presence by compensating weaker hardware with software optimization and scale. U...
On April 23, 2026, TSMC unveiled at the 2026 North America Technology Symposium its Compact Universal Photonic Engine (COUPE) platform built on Co-Packaged Optics (CPO) technology, with mass productio...
As U.S. export controls extend from chips to AI infrastructure, the traditional optical interconnect industry is undergoing supply chain restructuring. While optical modules are not subject to blanket...
The semiconductor industry is undergoing a structural shift in 2026, with competition moving beyond process node scaling toward system-level architecture. On the technology front, 2nm gate-all-around...
Intensifying global geopolitical conflicts are driving up defense spending, and warfare is pivoting toward asymmetric and information warfare, making low-cost unmanned vehicles (UAVs) crucial. China i...
In AI inference, MoE architectures and long-context processing have sharply increased memory-capacity requirements for model weights and KV cache, shifting the bottleneck from insufficient compute to...
With the generative AI market expanding at a CAGR of over 35%, data throughput for a single large language model (LLM) training task has reached the exabyte (EB) level. As transmission speeds evolve t...
For the current year of 2026, TSMC plans to establish a trial production line CoPoS through its subsidiary, VisEra, with trial production scheduled for 2027. Consequently, this year will be a critical...
