The need for power integrity in AI servers is extending from the board level directly into the package. This shift is driving a transition in capacitor technology, moving beyond a sole reliance on traditional multi-layer ceramic capacitors (MLCCs) toward a layered, complementary approach utilizing both silicon capacitors and MLCCs. While MLCCs remain the primary components for system-level decoupling, filtering, and voltage regulation across PCBs, VRMs, power shelves, and power modules, silicon capacitors offer distinct localized advantages. Their thin profile, low equivalent series inductance (ESL), excellent high-frequency characteristics, and stable capacitance under DC bias and temperature fluctuations make them ideal for near-die decoupling around GPUs, ASICs, HBMs, and within advanced packages. As AI accelerators increasingly adopt chiplets, HBM stacking, and high-power packaging, silicon capacitors are poised to become vital complementary components for package-level power integrity in AI and HPC applications.

Key Highlights

• Power integrity demands in AI servers are extending from boards into packages.
• Capacitor strategy is shifting from only MLCCs to a complementary mix of silicon capacitors and MLCCs. 
• MLCCs stay dominant for system-level decoupling, filtering, and voltage regulation across power distribution.
• Silicon capacitors, with thin form, low ESL and stable high‑frequency behavior, are suited for near‑die decoupling in advanced packages.
• As chiplet architectures, stacked HBM and high‑power packaging proliferate in AI and HPC, silicon capacitors are emerging as essential complements for package‑level power integrity. 

Table of Contents

1. Advantages of Silicon Capacitors: Low ESL and Stability in High-Voltage, High-Temperature Environments
   • Figure 1: Schematic Diagram of a Silicon Capacitor
   • Figure 2: Capacitance Variations Between Silicon Capacitors and MLCCs Under Voltage and Temperature Changes
2. Silicon Capacitors Address MLCCs’ Limitations Within Packages, Thus Establishing a Division of Labor for Power Integrity
   • Table 1: Comparison Between MLCCs and Silicon Capacitors
3. As Power Supply Bottlenecks Shift from the PCB to Inside the Package, Silicon Capacitors Emerge as a Solution
   • Figure 3: Primary Placement Locations for Silicon Capacitors
4. Major Silicon Capacitor Manufacturers and Supply Chains in Taiwan, Japan, and South Korea
   • Table 2: Corresponding Dynamics of Silicon Capacitor Technology Among Taiwanese, Japanese, and South Korean Suppliers
5. Future Development: Silicon Capacitors to Slowly Become Standard Configuration for Advanced Packaging of AI
   • Figure 4: Future Technical Orientations and Existing Challenges of Silicon Capacitors
6. TRI’s View

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