NVIDIA Announced Next-Gen B300, Rubin, and Vera at GTC 2025; Shift from GB NVL72 to VR NVL144 and Rubin Ultra NVL576 to Advance Memory, Liquid-Cooling, and CPO Communication Network

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2025-03-19

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TrendForce reports NVIDIA announced next-gen B300, Rubin, and Vera at GTC 2025, emphasizing memory, liquid-cooling, and CPO network advancements, shifting from GB NVL72 to VR NVL144 and Rubin Ultra NVL576. NVIDIA stresses scaling up, developing open-source software Dynamo through edge AI inference. Vera Rubin NVL144 TDP is expected to reach 200kW, making liquid-cooling inevitable. Rubin Ultra adopts 1024GB HBM4e, with technical challenges increasing supply risks. Vera CPU enhances core performance and supports upgraded memory specifications. NVIDIA promotes switch solutions based on silicon photonics/CPO. TSMC actively researches CPO, aiming to complete first-gen optical communication development in 2025, gradually improving AI chip performance.

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Category: Semiconductors

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