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NVIDIA has resumed sales of its AI chip H20 in China, prioritizing this year's targets. TSMC's production capacity could be a bottleneck. NVIDIA will also launch the Blackwell platform RTX PRO 6000 to address diverse application needs.
Cloud data center expansions drive upgrades in power and cooling supply chains. BBU lithium batteries and liquid cooling are key trends, offering growth opportunities for related suppliers.
NVIDIA H20 may resume sales to China, boosting AI GPU supply and demand for HBM and GDDR. US policy shift favors Chinese adoption of high-end AI chips. New products like RTX PRO 6000 will further support diverse AI developments.
The AI ASIC market is rapidly expanding, with TPUs shifting from internal use to external commercialization due to their energy efficiency and customization. Leading cloud and tech firms actively develop in-house ASICs to reduce costs and supply risks, driving AI hardware toward high performance, low power, and diverse applications, becoming the main accelerator after GPUs.
MRDIMM addresses high-core CPU and AI needs, enhancing memory efficiency, but standards, cost, and support limit adoption.
LPDDR4X supply has tightened rapidly due to reduced production and EOL plans by major suppliers, driving prices sharply higher. Under dual pressure from supply constraints and price surges, smartphone brands are accelerating the shift to LPDDR5X, though entry- and mid-tier models face challenges converting due to processor limitations.
Glass substrates are emerging as a highly promising solution in advanced semiconductor packaging with recent breakthroughs in Through-Glass Via (TGV) technology. They are poised to drive innovation in CoWoS, CPO, and FOPLP technologies. Leveraging superior high-frequency performance, low coefficient of thermal expansion (CTE), and excellent dimensional stability, glass substrates significantly enhance I/O density and signal integrity. This makes them particularly well-suited for large interposers, multi-layer stacking, and high-frequency RF applications. As major players such as Intel，Samsung and TSMC actively invest in the development and adoption of glass substrates, the widespread application of TGV technology is set to profoundly accelerate the advancement of cutting-edge packaging technologies.
Cloud giants accelerate self-developed AI ASICs, boosting market scale and projects. Driven by internal needs and geopolitics, ASIC share will rise, with next-gen ASICs from major cloud providers expected to ramp up in 2026, a key growth year.
US may cancel China facility technology exemptions; however, with mature processes in place, case-by-case reviews are expected to keep the supply chain stable with limited market impact.
"TrendForce reports that suppliers are phasing out DDR4 and prioritizing the more profitable server market, leading to a continued tightening of PC DDR4 supply. Consequently, PC OEMs have been aggressively securing orders since June to ensure inventory, adopting a more open stance in price negotiations. This has led to an upward trend in Q3 contract prices and a clear shift in bargaining power towards suppliers. Uncertainty surrounding US tariff policies is also fueling short-term stocking behavior, further intensifying upward price pressure and rapidly narrowing the price gap between DDR4 and DDR5.
