- About Us
-
Research Report
Research Directory
Semiconductors
LED
Consumer Electronics
Emerging Technologies
- Selected Topics
- Membership
- Price Trends
- Press Center
- News
- Events
- AI Agent
TrendForce indicates AI-driven data explosion causes structural changes in data center storage. HDD shortage accelerates QLC SSD demand, especially high-capacity products. Despite cost considerations, the widening HDD gap prompts North American CSPs to evaluate QLC SSD as cold data storage alternative. Supplier capacity constraints and CSP price sensitivity lead to short-term price negotiations, but in the long run, unresolved HDD issues will lead to explosive growth in QLC SSD demand.
AI compute faces memory bottlenecks. HBM's capacity/cost are limits. NAND Flash, via HBF (high-capacity near-memory) and AI SSD (intelligent preprocessing), optimizes AI architecture, redefining its value and role.
The iPhone 17 lineup officially welcomes a new ultra-thin flagship model. Apart from the base variant, all models in the series feature notable upgrades in design and hardware specifications. Although the overall smartphone market faces increasing challenges, both in demand and pricing, shipments are still expected to see slight growth over last year. The Pro series will remain the primary sales driver, while the market acceptance and sales performance of the new Air model will require time to be validated.
The surge in AI applications has fueled the development and growth of the semiconductor industry but has also brought new challenges. Apart from advanced process technology nearing physical limits and the increasing difficulty of process miniaturization, heat dissipation has emerged as a primary concern for major semiconductor foundries.
Chips used in AI servers, particularly GPUs, continue to improve in terms of performance. Consequently, the thermal design power (TDP) of individual chips has reached kilowatt levels. The traditional air cooling technology is approaching its physical limits, making way for the rise of liquid cooling technology. At the same time, the semiconductor industry and related academic research institutions are actively investing in the development of embedded liquid cooling solutions within chips.
Oracle's demand for GB Rack surges; production complexity slows early shipments; NVIDIA H20 faces geopolitical challenges but retains growth potential.
Micron has announced the halt of future mobile NAND Flash development, shifting focus to higher-margin areas like SSDs and HBM. This move addresses market competition and sluggish demand, reallocating resources to more profitable sectors, enhancing competitiveness.
Current progress in humanoid robotics is centered on optimizing vision-language-action (VLA) models, integrating multimodal data, and enhancing instruction comprehension as well as the ability to interpret human intent. Training relies heavily on world models, human video data, and VR-based remote training, with increasing emphasis on first-person perspectives to strengthen perception. While the ultimate goal is to achieve general-purpose humanoids, development remains constrained by significant challenges, leading Western and Chinese companies to pursue divergent technological pathways.
In its endeavor to bolster its global leadership, the United States is actively promoting the reorganization of supply chains and the repatriation of manufacturing through the implementation of reciprocal tariffs and a significant increase in strategic investments. This report provides a comprehensive examination of the U.S. smart manufacturing landscape, with specific attention to the semiconductor, automotive, and fast-moving consumer goods (FMCG) sectors. It delves into the strategic postures of key companies and their deployments in hardware (e.g., chips and sensors), software, and integrated systems.
In 2025, the electronics industry sees diverging trends: strong AI demand, weak consumer devices, early pull-in erases seasonality, and future growth slows.
In the second half of 2025, DDR4 faces structural shortages and soaring prices due to limited capacity and robust demand, with supply prioritized for servers. PC and consumer markets struggle with high prices and low availability, accelerating DDR5 adoption amid unresolved supply tension.
