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AI drives surging memory demand, prompting capex revisions. However, limited cleanroom space and a shift to advanced tech over raw capacity will constrain future bit output growth. Equipment vendors are optimistic, yet memory tech hurdles rise.
North American cloud giants are substantially increasing Capex, signaling an investment peak in AI infrastructure over the next two years. Shifting to large-scale, long-term strategies, they are focusing on high-end GPU Racks and accelerating in-house AI ASIC development to secure market leadership and drive rapid AI server growth.
2024 SSD market faced conservative demand; Kingston led, Chinese brands rose, intensifying the "big get bigger" trend. Module makers differentiated, targeting new markets, with AI driving future high-capacity SSDs.
AI-driven demand push chiplet-based packaging; EMIB costs less than CoWoS, signaling a move to modular, efficient interconnects.
Tariffs and policy changes kept early demand cautious, but cloud expansion and AI investment have lifted memory demand and pricing, tightening DRAM supply. The DDR5 uptrend is established, with profitability likely to surpass HBM3e; vendors’ capacity allocation and pricing strategies will reshape the market landscape.
AI-driven data centers evolve from single-chip to heterogeneous multi-GPU architectures. High-speed optical interconnects enable scalability, while silicon photonics and co-packaged optics boost bandwidth and energy efficiency amid modular, ecosystem-based competition.
This report analyzes the capital expenditure structure of a typical hyperscale AI data center, breaking down the spending into physical infrastructure, IT computing facilities, and networking equipment. Among these, the investment in computing systems, which are servers, is the most significant. As the proportion of higher-end, higher-power AI servers in new projects continues to rise, the cost share of computing systems is expected to increase further.
AI is sweeping across the world at an unprecedented pace. From training LLMs to powering ubiquitous generative AI applications, data has become the lifeblood of this technological revolution. The massive wave of data generated by AI is putting immense pressure on global data center infrastructure, especially in the storage domain, where a profound transformation is quietly taking place.
Traditionally, nearline HDDs have been the backbone of large-scale data storage. However, they are now facing an unprecedented supply crisis. At the same time, SSDs, long regarded as high-performance yet high-cost solutions, particularly high-capacity QLC SSDs, are being thrust into the spotlight.
This chain reaction, triggered by HDD shortages, is not merely a supply chain issue, it is a catalyst accelerating the rewriting of the storage market’s rules and signaling explosive growth for QLC SSDs in the coming years. This report delves into the causes, challenges, and future dynamics of this trend.
2026 NAND Flash: AI drives explosive enterprise SSD demand, offsetting weak consumer markets. HDD shortages compel a shift to high-capacity QLC SSDs. Despite bit growth, supply for these remains structurally tight, ensuring sustained price increases and a significant market pivot.
The repatriation policy of the US semiconductor manufacturing is spurring suppliers to increase investment in the US and accelerate plans for plant establishment. Due to the high labor costs and scarcity of technical talent in the US market, suppliers are striving to introduce solutions of automated semiconductor production. AI and digital twin technology are becoming the core of smart manufacturing by benefiting production efficiency and yield improvement. Moreover, with the upgrade in coverage rate and deployment flexibility of smart logistics equipment, it is expected to develop from single equipment to a multi-equipment collaborative ecosystem. Taiwanese suppliers such as Techman and KENMEC are actively seizing opportunities in the US semiconductor automation market through their technological prowess and system integration experience.
