Demand for large panel driver ICs is set to rise sequentially throughout 2024, with ample overall supply. However, uncertainty in end-user demand has led to conservative stocking practices in the supply chain, fostering a reliance on short-term, rush orders—a practice that threatens long-term supply chain health.
In 2023, mobile TDDI chips benefited significantly from active repair and second-hand markets, resulting in annual shipments far exceeding intial forecasts. The release of lower-cost capacities by Chinese wafer foundries has helped sustain robust demand for mobile TDDIs through 2023 to 2024. Nonetheless, intense comptition in this segment has escalated price wars.
For AMOLED driver ICs, the introduction of new production capacities has boosted demand as AMOLED smartphone panel penetration increases. Currently, the market faces no-short-term supply shortages. As more suppliers enter the AMOLED DDI market, prices continue to decline. Maintaining profitability in AMOLED DDI production remains a critical challenge for IC manufacturers, especially with stable wafer prices.
1. Different Types of Automotive Main Control Chips
2. MCU
3. Cockpit SoC
4. Autonomous Driving SoC
5. TRI’s View
As global internet data transmission volume continues to reach new highs, the performance bottleneck of light communication solutions becomes increasingly apparent. This report, on the one hand, explores the shortcomings of existing light communication solutions. On the other hand, it focuses on silicon photonics and CPO technology, analyzing their competitive advantages in the field of light communication, and keeping track of the development dynamics of key manufacturers.
The global silicon/semiconductor intellectual property (IP) market scale came to US$6.7 billion in 2023 at a YoY growth of 8.1%, with soft IP core (including firm IP core) and hard IP core respectively accounting for 67.2% and 32.8%. IP core designs, in the hope of fulfilling diversified industrial demand, are expediting in transition to semiconductor solutions that are high in performance, flexibility, and integration. Leading vendors include ARM, M31, Andes Technology, and VeriSilicon.
1. Developments in IC Design – Taiwan and Worldwide
2. Smartphone Chipset (Mobile SoC) Market and Suppliers
3. Wi-Fi Chip Market and Suppliers
4. TRI’s View
1. Cloud AI Chips: Market Status
2. CSP In-House AI Chip Manufacturing: US
3. CSP In-House AI Chip Manufacturing: China
4. TRI’s View
1. Development of Global AI Industry Chain
2. Analysis of Cross-Modal Business Opportunities in AI
3. A Breakdown of Hardware Supply Chain
4. TRI’s View
1. Global Overview of the AI Market Development
2. The Necessity of Openness in AI Development
3. Current Applications and Development of AI
4. TRI’s View
Gallium Arsenide (GaAs) is recognized in the industry as the most mature compound semiconductor material after silicon. It possesses superior characteristics such as high frequency, high electron mobility, high output power, low noise, and good linearity, making it one of the most important support materials for microwave radio frequency and optoelectronics.
In recent years, a surge in applications like 5G communications, autonomous driving, advanced displays, and AI has driven an increased demand for GaAs. Consequently, manufacturers are fully committed to capturing a significant share of this growing market.
Power semiconductors are the core of energy conversion and circuit control in electronic devices, playing vital roles in power conversion, amplification, switching, circuit protection, and rectification in electronic circuits. They are primarily used for altering voltage and frequency, as well as converting DC to AC in electronic devices. Power semiconductors have a key and extensive role in fields such as automobiles, industry, railway transportation, and power. As the new energy sector grows, particularly in solar energy and electric vehicles, power semiconductors such as IGBT and MOS are also becoming increasingly important in the realm of sustainable energy.