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Driven by strong demand, TSMC accelerates global expansions for advanced nodes and packaging; UMC pushes joint-node sampling despite delays and develops silicon photonics; Vanguard comprehensively raises prices and evaluates overseas expansion; PSMC optimizes profits via memory partnerships, line consolidation, and price hikes.
Driven by robust AI demand, 2026 foundry revenue is set to grow significantly. Advanced nodes and packaging capacities are fully loaded, leading to price hikes. Meanwhile, 8-inch capacity is tightening due to strategic production cuts and rising AI power IC demand. In contrast, 12-inch mature nodes remain weak due to soft consumer electronics market, resulting in a highly polarized industry landscape.
Driven by AI and new smartphone momentum, 2025 global foundry revenue hit record highs, with TSMC extending its market lead via advanced processes. For 2026, despite pre-stocking triggered by anticipated price hikes, AI remains the primary growth engine, while the sustainability of 2H consumer demand warrants close monitoring.
Market outlook diverges: Samsung accelerates US expansion despite yield risks. Rising memory costs slow SMIC and Nexchip, while AI orders boost HuaHong. GlobalFoundries significantly increases capex for localization in US and EU.
The Platinum reports provide analyses of the foundry industry, starting from TrendForce’s memory industry analysis and application demand in the downstream, extending to the semiconductor upstream, encompassing wafer production capacity, process node roadmap, and capacity utilization of each fab. The Platinum reports provide detailed analyses of foundries' competitiveness and capacity utilization rates, specifically focusing on major players including TSMC, UMC, Samsung, SMIC, and GlobalFoundries, etc.. The Platinum reports also discuss the future outlook of the foundry market.
AI fuels HBM/storage price hikes, pushing Memory revenue past Foundry. While weak mature nodes and capacity barriers slow Foundry, Memory's output efficiency and price volatility drive its market dominance through 2026.
Samsung rebounds via advanced nodes and US fab restart. SMIC and Nexchip enhance HV tech amid pricing pressure. HuaHong optimizes fab allocation. Smaller foundries slow expansion due to technical hurdles, showing a market split between advanced and mature nodes.
AI drives TSMC's expansion and upgraded targets. Vanguard sees rising utilization and prices via power ICs. UMC grows steadily, while PSMC rebounds through memory demand.
Driven by accelerated 8-inch capacity cuts by TSMC and Samsung, coupled with rising demand for AI power components and panic stocking across the supply chain, the global supply-demand structure for 8-inch wafers is tightening. This significant rebound in utilization rates has prompted major Chinese, Korean, and Taiwanese foundries to initiate price hike strategies.
Intel is expanding advanced packaging globally to secure CSP orders but trails TSMC in yield and turnkey solutions. Despite EMIB's technical challenges, the growing AI market offers opportunities for both, moving beyond a zero-sum game.
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