CSPs scale ASICs alongside GPUs, lifting packaging demand as CoWoS-L leads while EMIB-T and FOPLP emerge as new options.
Taiwan foundries see a strong 2027 as utilization rises, capacity expands, and prices climb across the board.
AI peripheral demand drove advanced nodes and spilled into mature nodes, while consumer restocking continued, lifting 2Q26 revenue to a new high. Top five stayed stable; VIS rose on stronger demand, reshuffling sixth-to-tenth. Growth should continue.
A Vanguard Fab3 rooftop fire spared the cleanroom; output resumed, CMP is recovering, revenue impact stays limited.
The Platinum reports provide analyses of the foundry industry, starting from TrendForce’s memory industry analysis and application demand in the downstream, extending to the semiconductor upstream, encompassing wafer production capacity, process node roadmap, and capacity utilization of each fab. The Platinum reports provide detailed analyses of foundries' competitiveness and capacity utilization rates, specifically focusing on major players including TSMC, UMC, Samsung, SMIC, and GlobalFoundries, etc.. The Platinum reports also discuss the future outlook of the foundry market.
2Q26 foundry revenue rose broadly; overseas, China fab expansion should keep capacity tight, lifting full-year momentum.
TSMC, UMC, Vanguard and PSMC posted higher 2Q26 revenue on price hikes and strong demand, with capex broadly raised.
China's lithography drive poses little threat to ASML, but other mature-node process gains erode Western and Japanese rivals' revenue.
A major quake hit TSMC's JASM fab in Kumamoto, forcing a brief halt, but damage looks contained and impact stays limited.
AI demand reshapes foundry priorities: photonics, packaging gains, tight mature nodes, rising power investment.
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