Dec. 27 Taiwan Quake: Foundry and DRAM Impact Update
Last Modified
2025-12-29
Update Frequency
Aperiodically
Format
The recent Taiwan earthquake caused brief stoppages and minor wafer scrap in northern fabs. With no major facility damage and spare capacity available for makeup, operations are recovering strictly. The overall financial and operational impact is assessed as minimal.
Key Highlights
- The earthquake primarily impacted northern foundry and DRAM facilities, causing limited wafer scrap in furnaces and preventative evacuations.
- Inspections confirmed no major infrastructure damage; equipment recovery is proceeding smoothly with lines resuming operation.
- Losses are being mitigated via spare capacity and inventory, resulting in a negligible impact on quarterly revenue and output.
Table of Contents
- Introduction
- Damage Assessment Update for Foundry Fabs Following Dec. 27th Earthquake
- Damage Assessment Update for Memory Fabs Following Dec. 27th Earthquake
<Total Pages: 7>

Category: DRAM , Wafer Foundries
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