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Server DRAM prices are set for a sharp surge in early 2026 driven by critical shortages. Suppliers retain strong leverage, with Korean makers delaying quotes to maximize hikes. Despite capacity reallocation, significant supply gaps persist as the market shifts to higher-speed specifications.
Google integrates TPU v7/v8, Ironwood racks, and Apollo OCS into a unified fabric, shifting the scaling unit from servers to racks. This drives 800G+ optical module penetration above 60% by 2026. Supply chain focus has shifted to laser chips and MEMS capacity. Strategic decisions must now track 800G/1.6T transceiver deployments, alongside GPU/TPU shipments, to accurately gauge the AI compute cycle.
Persistent DRAM supply shortages have empowered suppliers, driving sharp upward revisions in contract prices. High-margin Server DRAM now leads profitability, prompting capacity shifts. Consequently, pricing trends remain strong with limited negotiation room for buyers.
Driven by the AI Agent boom and Nvidia’s new DPU, Enterprise SSD demand has exploded. With suppliers prioritizing DRAM, severe shortages have triggered panic buying and record-breaking price hikes. As high-capacity SSDs become critical for AI, supply constraints and rising costs are expected to persist.
In 2026, benefiting from strong capital expenditure by North American CSPs, AI server shipments and revenue share are expected to rise significantly, driving supply chain expansion and the development of liquid cooling technologies. Industry players such as Foxconn, Quanta, Wistron, and MGCooling are actively deploying rack-level and data center system liquid cooling solutions as well as overseas production capacities. Despite lingering geopolitical variables, overall market momentum remains robust.
Driven by policy, Chinese firms accelerate HBM development to support domestic AI chips. CXMT targets advanced nodes while JHICC focuses on mature processes. Both face technical hurdles and are in early verification stages, having limited global impact but aiming for long-term self-sufficiency.
Micron acquires PSMC’s Tongluo facility to accelerate capacity expansion, alongside agreements for DRAM technology licensing and advanced packaging. This strategic partnership resolves Micron’s AI-driven bottlenecks and enhances PSMC’s mature process capabilities, significantly boosting future industry supply and technical depth.
With our expertise in the memory market, this provides a comprehensive analysis and forecast on HBM market share, ASP, wafer capacity, demand consumption, etc.
Driven by robust Server and AI demand, the displacement of DDR5 capacity has triggered price surges. HBM3e prices are poised to rise due to increased orders and specification upgrades, strengthening supplier bargaining power. Although SRAM offers low latency, cost and capacity constraints ensure it remains complementary to HBM rather than a replacement.
Despite market headwinds, strategic pivots and supply chain optimization successfully offset revenue pressure. Cost controls significantly improved margins. With continued R&D investment strengthening competitive moats, analysts see robust long-term growth and maintain a positive outlook.
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