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AI demand lifts memory; fab limits push per-wafer pricing. HBM tight; suppliers favor DDR5; extras may rise.
This report notes AI investment drives cloud and server demand as CSPs and OEMs expand capex and deployment, with in-house chips advancing.
Server DRAM prices are projected to surge due driven by tight supply and robust cloud service provider demand. To secure supply, clients are aggressively negotiating long-term agreements, incentivizing manufacturers to expand capacity. Manufacturers are shifting production focus to high-margin DDR5. Market anticipates persistent undersupply, with substantial new capacity taking years to come online, while process upgrades accelerate short-term. PC DRAM also rises, but less significantly.
AI's evolving demands shift storage from HDDs (high latency) to SSDs (speed, low latency). SSDs offer superior performance and TCO benefits, accelerating their adoption in AI infrastructure.
AI drives surging memory demand, prompting capex revisions. However, limited cleanroom space and a shift to advanced tech over raw capacity will constrain future bit output growth. Equipment vendors are optimistic, yet memory tech hurdles rise.
This report analyzes the global AI server market and supply chain, highlighting key players, tech shifts, and demand-capacity balance.
North American cloud giants are substantially increasing Capex, signaling an investment peak in AI infrastructure over the next two years. Shifting to large-scale, long-term strategies, they are focusing on high-end GPU Racks and accelerating in-house AI ASIC development to secure market leadership and drive rapid AI server growth.
Strong CSP demand is driving server DRAM prices significantly higher, with 4Q25 increases revised upwards. CSPs are proactively securing 2027 supply, incentivizing manufacturers to boost capacity, signaling a sustained upward price trend.
Major suppliers are expanding HBM capacity, with 2025 shipments revised upward. SK hynix leads with 150K TSV capacity, while Micron ramps up its Taiwan facilities. By 2026, all three will begin HBM4 mass production, with Samsung’s shipment growth expected to lead.
AI servers lead growth; cloud build-outs lift ODMs/thermal. AMD ramps; TPU up; shift to L2L cooling. Supply chain heat-up end to end.
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