- About Us
-
Research Report
Semiconductors
LED
Consumer Electronics
Emerging Technologies
- Selected Topics
- Membership
- Price Trends
- Press Center
- News
- Events
- AI Agent
Enterprise SSD Datasheet provides you with the latest SSD density and shipment forecast for server equipment and data centers. Also, enterprise SSD interface, form factor breakdown, and read / mixed read / write load / write intensify Enterprise SSD breakdown.
TrendForce offers you a complete analysis on DRAM industry supply/demand sufficiency, cost analysis and price forecast.
TrendForce offers you a complete analysis on DRAM industry supply/demand sufficiency, cost analysis and price forecast.
AI server demand surges on hyperscale and inference workloads, lifting CSP rack-scale buildout amid grid constraints.
As NVIDIA and ASIC platforms expand, AI data center power and liquid cooling capacities face tightening supplies. Chinese firms Megmeet and Honor have successfully entered global supply chains, achieving breakthroughs in high-power sectors. In thermal management, liquid cooling is shifting toward system-level integration, with Vertiv and AVC benefiting from dual GPU/ASIC demand, driving significant long-term value growth.
The three major HBM suppliers highlighted HBM4 mass production and HBM4e development, as competition shifts toward pricing power and next-generation specs. Suppliers also remain positive on long-term HBM pricing despite stronger conventional DRAM profitability.
CSP Capex fuels AI server growth; GPU and ASIC engines drive market upgrades as liquid cooling adoption accelerates.
AI server market expands robustly in 2026 amid hyperscaler capex, NVIDIA racks, and tight HBM-CoWoS supply chains.
NA CSPs raised Capex sharply, cementing AI infra as core strategy and powering AI server and data center growth.
HBM grows strongly in 2026 as CSP/ASIC demand lifts HBM3e prices; SK hynix leads, Samsung rebounds, Micron expands TSV.
Research Areas:
Industry News
