Driven by strong demand from cloud service providers, the demand for HBM and server modules has surged. However, constrained by long equipment lead times and capacity reallocation, supply growth continues to lag behind. As traditional memory is severely squeezed, the market supply deficit remains difficult to resolve, keeping prices elevated. Consequently, capital expenditures and procurement strategies require continued close attention.
Global Capex rises on AI buildout as China speeds self-reliant chips, easing foreign hardware reliance.
Global Server Market – Trends and Outlook for 3Q26
Global AI server momentum builds as CSPs expand rack buys, hyperscalers advance in-house chips, and OEM orders grow.
JEDEC-defined SPHBM4 frees HBM from the interposer, trading latency and power for cost and layout.
As global computing power expands, traditional cabling faces severe thermal and power bottlenecks. Emerging Micro LED CPO technology, with its micron-level size and ultra-low power consumption, has become an ideal alternative for short-distance high-speed transmission in data centers. Despite processing hurdles and fierce competition, supply chain alliances are expected to drive mass production and substantial market value in the coming years.
With our expertise in the memory market, this provides a comprehensive analysis and forecast on HBM market share, ASP, wafer capacity, demand consumption, etc.
CSP capex growth lifts server and AI shipments, chip forecasts rise, ODMs shift to racks, cooling gains traction.
AI chip demand surges in 2026, with high-end GPUs dominating. NVIDIA leads, ASICs gain share, liquid cooling expands, and AI server value hits record highs.
Photonic packaging drives AI infra, shifting to mass production. CPO and glass platforms solve bottlenecks.
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