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Driven by the demand for both AI and general-purpose servers, enterprise SSDs are facing a severe supply-demand gap, leading to continuous surges in contract prices. Meanwhile, to address the pain point of high AI inference costs, suppliers are accelerating the rollout of low-latency, high-performance SSDs. This is driving a transformation in storage architectures and creating a high-margin blue ocean market.
Global CSPs expand AI infrastructure investment, with Google and Microsoft leading on TPU and GPU racks while Chinese peers diversify amid geopolitical constraints.
Memory pricing hits a historic inflection as server DDR5 profitability overtakes HBM; CSP long-term contracts lock in floors, signaling a sustained upward pricing trend into 2027.
With our expertise in the memory market, this provides a comprehensive analysis and forecast on HBM market share, ASP, wafer capacity, demand consumption, etc.
NVIDIA shifts AI competition from computing performance to system interconnects, leveraging CPO and silicon photonics to break I/O bottlenecks. By integrating high-speed fabric with advanced packaging, it redefines data center efficiency and accelerates the optical supply chain transition.
AI server demand stays robust with GB leading H1; Rubin ramps in Q3. ASIC share dips slightly as GPU dominates. Component shortages cap general server growth. Liquid cooling competition intensifies.
Arm's AGI CPU marks a strategic shift from IP licensor to platform provider, targeting AI data centers and accelerating Arm's gains against x86.
Driven by AI and general servers, industry value grows robustly. Despite geopolitical risks and custom chip delays, NVIDIA and AMD's push for premium integrated racks significantly boosts average prices. Meanwhile, advanced packaging and high-bandwidth memory remain in tight supply, with liquid cooling officially becoming the mainstream standard.
Server DRAM prices surge on tight supply but future hikes will ease. Buyers globally rush to secure long-term contracts.
Rapid AI factory scaling is reshaping data center infrastructure. In the near term, independent power racks stabilize power delivery, while the mid-to-long-term roadmap points to centralized HVDC distribution and solid-state transformers. Meanwhile, next-gen AI architectures are fully adopting liquid cooling, elevating it from optional to essential and driving deep cross-domain supply chain collaboration.
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