Huawei is preparing its next wave of flagship smartphones as it advances its in-house chip development. According to MyDrivers, sources say the company plans to unveil the Mate 90 series and next-generation Mate XT2 tri-fold smartphone in September. Both models will reportedly feature the Kirin 202...

Memory giants are increasingly turning to custom HBM as the next growth engine. At the KeyBanc Technology Leadership Forum 2026, Micron EVP Sumit Sadana, according to Investing.com, said the shift toward custom HBM will begin with HBM4E, with the company planning to work with customers on custom SKU...

SK hynix is reportedly restarting investment in its second NAND flash plant in Dalian, China. According to Seoul Economic Daily, sources say the company’s NAND subsidiary Solidigm resumed investment in Dalian Fab 2 in the first half of this year and has completed construction of the fab building. ...

According to TrendForce’s latest memory spot price trend report, DRAM spot trading remains subdued as buyers and sellers remain far apart on pricing, with the average spot price of mainstream chips (DDR4 1Gx8 3200MT/s) edging up 0.93%. In NAND flash, NAND spot trading remains sluggish, though 512G...

Competition in AI advanced packaging is heating up, with ASE subsidiary SPIL accelerating capacity expansion. According to Commercial Times, SPIL broke ground on August 11 on a nearly TWD 100 billion, 6-hectare plant in Douliu, Yunlin, which will introduce CoWoS advanced packaging and begin first-ph...