Intel is collaborating with SoftBank’s subsidiary SAIMEMORY to advance a potential alternative to conventional high-bandwidth memory (HBM). According to TechPowerUp, SAIMEMORY plans to present a paper at VLSI Symposium 2026 in June, detailing its newly developed HB3DM memory based on Z-Angle Memor...

Riding an AI-driven semiconductor supercycle, Samsung’s Device Solutions (DS) division delivered a historic first quarter, with operating profit surpassing KRW 50 trillion for the first time, according to The Chosun Daily. The report highlights the unit’s overwhelming dominance, accounting for 9...

On April 28, Lightelligence—often described as the world’s first publicly listed AI silicon photonics chip listed company—debuted on the Hong Kong Stock Exchange. The company issued 13,795,215 shares at HKD 183.2 each, raising HKD 2.53 billion. Net proceeds came to HKD 2.38 billion after li...

As glass substrates gain traction as a key material for next-generation AI semiconductor packaging, related technologies are drawing increasing industry attention. According to ETNews, Chonnam National University said a research team led by Professor Han Seung-hoe from the Department of Mechanical E...

According to TrendForce’s latest memory spot price trend report, in terms of DRAM, only DDR5 chips saw sporadic buying interest. DDR4 demand remained weak, with price cuts failing to revive purchasing activity. In the NAND flash segment, spot prices continued to drop over the past month, now arriv...