Shortly after touring SK hynix’s COMPUTEX booth in Taipei alongside NVIDIA CEO Jensen Huang on June 2, SK Group Chairman Chey Tae-won met with TSMC Chairman C.C. Wei for the first time in two years, according to a post by SK hynix on its official X account on June 4. Hankyung adds that the meeting...

As Intel’s EMIB (Embedded Multi-die Interconnect Bridge) advanced packaging gains traction and draws strong market attention, the company is reportedly accelerating capacity expansion globally. An Investor.com report suggests Team Blue is advancing EMIB capacity expansion in parallel, with its Ore...

The AI chip race is intensifying across the board, with advanced packaging growing in significance and driving a surge in OSAT capital spending. According to Commercial Times, Taiwan-based OSAT players ASE, Powertech, and King Yuan Electronics (KYEC) are expected to see their combined capital expend...

As global memory supply remains extremely tight amid the AI boom, Samsung’s looming large-scale strike is seen as further intensifying the strain. According to South Korean media outlets News1 and The Dong-A Ilbo, citing analysts, disruptions could reach 3–4% for DRAM and 2–3% for NAND, based ...

Ahead of TSMC’s earnings call later this week, the spotlight is once again on its advanced packaging roadmap—and CoWoS is no longer the only story. According to Commercial Times, TSMC’s CoPoS (Chip-on-Panel-on-Substrate) pilot line has already begun tool deliveries to R&D teams in February...