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IC Manufacturing, Package&Test


2026-07-01

[News] Intel Reportedly Breaks Ground on Santa Clara Expansion for Next-Gen EUV Mask Capacity

IC Manufacturing, Package&Test

As interest in Intel’s foundry services continues to grow among a broader range of tech giants like Apple and NVIDIA, the chipmaker is accelerating its U.S. manufacturing buildout. According to Wccftech, Intel has officially broken ground on the latest expansion of its Santa Clara, California camp...

2026-07-01

[News] World’s First Mass-Production Line for 6-/8-Inch Homoepitaxial Gallium Oxide Wafers Comes Online

IC Manufacturing, Package&Test

On June 24, 2026, Hangzhou Garen Semiconductor announced a major commercialization milestone: the company has successfully established the world’s first mass-production line compatible with both 6-inch and 8-inch homoepitaxial gallium oxide wafers. The company has already delivered 6-inch (100)-or...

2026-06-30

[News] Samsung Reportedly Restarts 1.4nm Push, Targets 2029 Mass Production to Close Gap with TSMC, Intel

IC Manufacturing, Package&Test

As Intel and TSMC both target 1.4nm mass production around 2028-29, Samsung—after reportedly delaying its own roadmap—is now re-entering the race. According to The Bell, the company has resumed efforts to commercialize its 1.4nm (SF1.4) foundry process, with mass production now slated for 2029, ...

2026-06-30

[News] Samsung, SK hynix 800 Trillion Won Expansion Strains Chipmaking Tool Supply, Potentially Pressures TSMC, Intel

IC Manufacturing, Package&Test

The global semiconductor industry is set to enter a new Warring States era, as Samsung Electronics and SK hynix unveiled a sweeping investment push in South Korea. According to The Elec, the two memory giants will jointly deploy 800 trillion won to build four new fabs in the country’s southwest, a...

2026-06-30

[News] China Signs First Domestic Ultra Wide Bandgap Semiconductor Full-Chain Project

IC Manufacturing, Package&Test

China’s Henan provincial government website revealed that Zhengzhou High-tech Zone signed an investment agreement with Sino Powder (Henan) on June 26, establishing the company's ultra wide bandgap semiconductor material production base. The project is described as China's first integrated ultra...

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