Subject


IC Manufacturing, Package&Test


2026-06-22

[News] Top Five Japanese Chip Toolmakers Reportedly See 10% China Sales Drop in FY25, Led by Front-End Weakness

IC Manufacturing, Package&Test

While China remains far from accessing ASML’s most advanced lithography systems, it is steadily strengthening its position in domestically used semiconductor tools. According to Nikkei, Japan is already feeling the impact, with its top five chipmaking equipment manufacturers posting a 10% decline ...

2026-06-22

[News] TSMC Reportedly Cuts 28nm Output by Over 25% Since Early 2026 as Advanced Node Push Accelerates

IC Manufacturing, Package&Test

As TSMC ramps up 2nm and 3nm production, it is also accelerating the phaseout of legacy nodes. Commercial Times, citing supply chain sources, reports that monthly wafer starts at Fab 15A, TSMC’s primary 28nm site, have dropped by more than 25% since the start of the year. The pullback in 28nm p...

2026-06-22

[News] MIT Announced Breakthrough in GaN-on-Single-Crystal Diamond Thermal Management Technology

IC Manufacturing, Package&Test

On June 8, 2026, the Massachusetts Institute of Technology (MIT) announced that its researchers had successfully embedded gallium nitride (GaN) transistors into an ultra-thin single-crystal diamond layer, overcoming a major thermal bottleneck in high-power wireless chips and developing a record-sett...

2026-06-19

[News] World’s Smallest Semiconductor Nanotube Achieved at 1 Nanometer

IC Manufacturing, Package&Test

A research team led by the The University of Tokyo has fabricated the world’s smallest semiconductor nanotube, according to a study published in the latest issue of Science. Using boron nitride (BN) nanotubes as a template, the researchers successfully synthesized single-walled molybdenum disulfid...

2026-06-19

[News] Intel Taps SK hynix Ex-CEO as Foundry EVP to Lead Advanced Packaging Push as EMIB, HBI Scale Up

IC Manufacturing, Package&Test

Intel CEO Lip-Bu Tan is accelerating the company's foundry ambitions, continuing to recruit seasoned talent from across the chip industry. The latest move is the appointment of Seok-Hee Lee as Executive Vice President of Intel Foundry, according to an Intel announcement on June 18. Notably, Lee j...

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