Memory is not the only segment where Samsung Electronics is pushing price increases amid surging AI demand. According to Financial News, the chip giant has reportedly raised prices for HBM4 logic dies by around 40–50% since early 2026, signaling a broader normalization of pricing across its semico...

On April 9, Intel Foundry Services announced a major technological breakthrough with the development of the world’s thinnest gallium nitride (GaN) chiplet. The silicon substrate has been reduced to just 19 micrometers—approx. one-fifth the diameter of a human hair. The chiplet is fabricated o...

Ahead of TSMC’s earnings call later this week, the spotlight is once again on its advanced packaging roadmap—and CoWoS is no longer the only story. According to Commercial Times, TSMC’s CoPoS (Chip-on-Panel-on-Substrate) pilot line has already begun tool deliveries to R&D teams in February...

Recently, a joint research team from the National University of Defense Technology and the Institute of Metal Research, Chinese Academy of Sciences, has made a major breakthrough in wafer-scale growth and controllable doping of a new class of high-performance two-dimensional (2D) semiconductor mater...

While Iran and the U.S. have agreed to a ceasefire contingent on guaranteed safe passage through the Strait of Hormuz, the helium crisis across the semiconductor supply chain shows temporary signs of easing. However, as highlighted by Forbes, Qatar’s Ras Laffan Industrial City, which supplies r...