Laser annealing adoption appears to be broadening. According to ETNews, the thermal treatment process is expanding beyond its traditional use in silicon (Si) wafers to silicon carbide (SiC), a material widely regarded as a leading candidate for next-generation power semiconductors. The report adds t...

As Intel advances its High-NA EUV roadmap for its A14 node, market attention has turned to TSMC’s comparatively cautious approach to the cutting-edge lithography tool, which is estimated to cost around US$400 million per system. However, at its June 4 shareholder meeting, TSMC Chairman C.C. Wei...

Shortly after touring SK hynix’s COMPUTEX booth in Taipei alongside NVIDIA CEO Jensen Huang on June 2, SK Group Chairman Chey Tae-won met with TSMC Chairman C.C. Wei for the first time in two years, according to a post by SK hynix on its official X account on June 4. Hankyung adds that the meeting...

Applied Materials is looking to expand its workforce in Southeast Asia. According to Nikkei, Brian Tan, the company's corporate vice president and president for Southeast Asia, said Applied Materials plans to hire at least 1,000 additional employees across the region this year, representing a 25% in...

As Rapidus advances toward its roadmap of 2nm mass production in 2027 and 1.4nm in 2029, a new technology breakthrough could lend support to its ambitions. According to Hokkaido Shimbun, the Leading-edge Semiconductor Technology Center (LSTC), a consortium formed by national universities in Japan an...