Subject


IC Manufacturing, Package&Test


2026-03-12

[News] UMC, HyperLight Team up to Mass-Produce TFLN Chiplets, Targeting 1.6T Data Center Bandwidth

IC Manufacturing, Package&Test

As traditional copper-based electrical transmission reaches physical limits, the semiconductor industry is increasingly turning to optical transmission technologies, with UMC joining the trend. HyperLight and UMC, along with the foundry’s wholly owned subsidiary Wavetek, announced a strategic part...

2026-03-12

[News] Peric Special Gases Drives China’s Tungsten Gas Push Amid Memory Boom and Rival Price Hikes

IC Manufacturing, Package&Test

As US-China tech tensions escalate, Beijing’s controls on strategic minerals like tungsten are rattling the supply chain. Among these, tungsten hexafluoride (WF₆), made from high-purity tungsten powder and fluorine gas, spiked in early 2026, with Korean and Japanese suppliers hiking prices 70–...

2026-03-11

[News] Applied Materials Teams Up with Micron, SK hynix for Next-Gen DRAM, HBM and NAND Development

IC Manufacturing, Package&Test

As the AI boom drives memory demand, semiconductor equipment makers are reaping the benefits while deepening ties with top memory producers. Applied Materials has teamed up with Micron and SK hynix to develop next-generation chips critical for AI and high-performance computing, according to Reuters....

2026-03-10

[News] Nexperia China Reportedly Launches 12-inch Chip Production, Defying Dutch Parent

IC Manufacturing, Package&Test

Amid rising semiconductor tensions, Nexperia’s Chinese unit, according to Reuters, announced on Monday that it has started producing its own chips, taking a further step toward independence from its Dutch parent amid a dispute that has rattled global automakers’ supply chains. The report, cit...

2026-03-10

[News] ROHM Secures GaN Technology License from TSMC, to Build Production Line by 2027

IC Manufacturing, Package&Test

Recently, ROHM announced that it will integrate its own R&D and manufacturing expertise in gallium nitride (GaN) power devices with the process technologies of long-term partner TSMC. The company plans to establish a dedicated production system at its Hamamatsu facility by 2027 to meet surging d...

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