As Intel gains traction with its 18A and 14A nodes, its advanced packaging business — particularly EMIB (Embedded Multi-die Interconnect Bridge) — is also drawing customer support amid tight substrate supply. Speaking at the J.P. Morgan Global Technology Conference, Intel CEO Lip-Bu Tan said sev...

Shanghai AI Laboratory announced a breakthrough in the stable production of photoresists — one of the core materials used in semiconductor manufacturing. As a critical material in chip fabrication, the quality of photoresists directly determines chip performance and manufacturing yield. Backed ...

As AI accelerator leaders such as NVIDIA continue rolling out chips with increasingly larger compute die sizes, panel-level packaging is gaining momentum. Notably, Germany-headquartered SCHMID — an equipment provider for printed circuit board (PCB) and IC substrate manufacturing — said in an Inv...

Since China tightened rare earth export controls, how has the industry adapted? According to Nikkei, analysis of Chinese customs data shows that between April 2025 and March 2026, exports of rare earth permanent magnets fell 4% year over year by volume to 58.1 million kilograms, while export value e...

Riding sustained AI-driven demand across both logic and memory, Applied Materials has struck a more bullish tone for 2026, projecting over 30% growth in its semiconductor equipment business and more than 50% growth in packaging revenue, according to Reuters. The outlook marks a notable upgrade fr...