As inference AI fuels a fresh wave of CPU demand, chip giant AMD posted a 57% YoY jump in first-quarter data center revenue—covering both server CPUs and AI accelerators—to US$5.8 billion. Notably, according to Reuters, CEO Lisa Su now sees the server CPU addressable market expanding at more tha...

As Intel’s EMIB (Embedded Multi-die Interconnect Bridge) advanced packaging gains traction and draws strong market attention, the company is reportedly accelerating capacity expansion globally. An Investor.com report suggests Team Blue is advancing EMIB capacity expansion in parallel, with its Ore...

As advanced packaging has emerged as a key growth opportunity amid the AI chip boom, equipment players are also making strategic moves across the value chain. According to ijiwei, Hong Kong–listed ASMPT has entered into a share purchase agreement with U.S. semiconductor equipment giant Applied Mat...

The AI chip race is intensifying across the board, with advanced packaging growing in significance and driving a surge in OSAT capital spending. According to Commercial Times, Taiwan-based OSAT players ASE, Powertech, and King Yuan Electronics (KYEC) are expected to see their combined capital expend...

Intel’s leading-edge nodes, spearheaded by 18A, are gradually building momentum, while its advanced packaging portfolio is also showing clear traction. According to Wccftech, Intel’s EMIB (Embedded Multi-die Interconnect Bridge) has reached 90% yield levels, with Google and Meta Platforms emergi...