As Meta lifts its 2026 capital spending to US$115–135 billion—nearly double its 2025 outlay—CNBC reports that the company’s investment push remains in full swing. Commercial Times notes that Meta’s sustained capex momentum is directly driving stronger demand for AI servers and ASICs (appli...

On January 21, JCET announced a major breakthrough in its co-packaged optics (Co-Packaged Optics, CPO) technology development. Silicon photonics engine products based on its XDFOI® multidimensional heterogeneous advanced packaging platform have completed customer sample deliveries and successful...

On January 21, Shanghai released its 2025 economic data. The city’s full-year GDP exceeded CNY 5.6 trillion, posting a year-on-year growth of 5.4% at constant prices. This growth rate not only surpassed the national GDP growth of 5%, but also marked an increase of 0.4 percentage points compared wi...

Global semiconductor packaging equipment leader ASMPT recently announced that it is evaluating strategic options for its Surface Mount Technology (SMT) business, including a potential sale, joint venture, spin-off, or public listing. According to EE Times China, divesting the SMT business would mark...

China’s chipmaking tool makers are gaining momentum amid the push for semiconductor self-reliance. According to Sina and the Economic Daily News, leading etching equipment supplier AMEC said on the 23rd that stronger shipments of high-end tools for advanced logic and memory—along with the ramp t...