Global semiconductor packaging equipment leader ASMPT recently announced that it is evaluating strategic options for its Surface Mount Technology (SMT) business, including a potential sale, joint venture, spin-off, or public listing. According to EE Times China, divesting the SMT business would mark...

China’s chipmaking tool makers are gaining momentum amid the push for semiconductor self-reliance. According to Sina and the Economic Daily News, leading etching equipment supplier AMEC said on the 23rd that stronger shipments of high-end tools for advanced logic and memory—along with the ramp t...

Intel has reportedly made fresh progress in glass substrate technology, indicating that the company has not exited the space despite market speculation. According to Wccftech, Intel Foundry displayed a “Thick Core” glass substrate integrated with its EMIB packaging technology at this year’s NE...

Amid strong market expectations, Intel reported a fourth quarter slightly above forecasts. However, transcripts from Investing.com and Reuters note that the chipmaker’s growth is being limited by its own supply, as it is struggling to keep up with strong demand for its server processors used in AI...

As back-end processes take on a larger role in the AI chip era, advanced packaging equipment is rising in strategic importance. According to Hankyung, leading chip equipment makers—including ASML, Applied Materials, Tokyo Electron (TEL), and Lam Research—are moving decisively into the advanced p...