While Samsung Electronics is accelerating its 2nm mass production ramp at its Taylor facility, SK hynix is simultaneously stepping up its advanced packaging push in the U.S. According to Herald Economy, the company has officially broken ground on its first semiconductor plant in the country—the In...

A magnitude 7.7 earthquake struck off Japan’s northeastern coast on April 20, putting renewed focus on potential disruptions to the semiconductor supply chain, given the region’s concentration of key memory production and chipmaking materials and equipment suppliers. According to ijiwei, Kiox...

Intel is expanding its advanced packaging footprint, as a company backed by Intel Capital is reportedly launching India’s first advanced 3D chip packaging facility. According to The Indian Express, the project—developed by U.S.-based 3D Glass Solutions (3DGS), in which Intel has invested, throug...

While the rapid expansion of major Chinese memory players has drawn growing market attention, Reuters reports that more than half of the equipment used in one of the new fabs may have been sourced from domestic suppliers, including key systems for vertical chip-layer stacking. If confirmed, this cou...

Samsung Electro-Mechanics and LG Innotek have reportedly initiated efforts to secure co-packaged optics (CPO) technology. According to ETNews, sources indicate that both companies have accelerated their push to integrate CPO into AI semiconductor substrates. Moving beyond the conceptual stage, they ...