[News] Intel-Backed Firm Breaks Ground on India’s 1st 3D Packaging Plant, Targeting ~70K Glass Substrates Annually

Intel is expanding its advanced packaging footprint, as a company backed by Intel Capital is reportedly launching India’s first advanced 3D chip packaging facility. According to The Indian Express, the project—developed by U.S.-based 3D Glass Solutions (3DGS), in which Intel has invested, through its wholly owned Indian subsidiary, Heterogeneous Integration Packaging Solutions—has broken ground.

Intel CEO Lip-Bu Tan, who joined the event virtually, expressed appreciation for the leadership of Prime Minister Narendra Modi, as indicated by Prameya News. He also highlighted Odisha’s strengths, citing reliable infrastructure, including power and water resources, and a skilled workforce as key enablers for advanced manufacturing.

3DGS is regarded as a global pioneer in its field. According to ANI, its investors include Intel and U.S. defense and aerospace company Lockheed Martin. Notably, according to Reuters, Intel Capital has invested a total of $8 million in 3DGS across two funding rounds since Tan became Intel’s CEO. Tan’s Walden held a 9.6% stake following the second financing.

As for Intel’s broader advanced packaging push, The Edge Malaysia reports that the chipmaker’s advanced packaging complex and assembly operations in Malaysia are slated to become operational later this year.

Project Scope, Capacity and Technology Positioning

Odisha Chief Minister Mohan Charan Majhi, as cited by The Indian Express, said the facility’s ₹1,934 crore proposal was approved under the India Semiconductor Mission (ISM) last year.

Regarding capacity, Edexlive reports that the facility is planned to produce around 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules annually. The products are expected to serve applications across defense, high-performance computing, AI, RF and automotive, as well as photonics and co-packaged optics.

Meanwhile, ETtech notes that the facility is designed as a vertically integrated operation combining substrate manufacturing, assembly, and advanced packaging within a single site, distinguishing it from conventional OSAT models. It aims to deploy technologies such as glass interposers and 3D heterogeneous integration modules.

This project is one of two semiconductor-related investments cleared earlier by the Centre for Odisha in 2025. The other, led by SiCSem Private Limited, will manufacture silicon carbide-based devices for applications including defense, electric mobility, rail infrastructure, and renewable energy systems, as noted by ETtech.

The country’s IT minister has signaled potential additional investment from global companies. According to ETtech, three additional electronics and semiconductor-related proposals are currently in the pipeline. The minister added that discussions are also underway with major global companies, including Intel, regarding future investments in the state.

Read more

• [News] Intel Advanced Packaging Reportedly Gains Traction vs. TSMC as Google, Amazon Weigh EMIB Adoption
• [News] Intel Ramps Up Advanced Packaging: Malaysia Complex Operational in 2026, EMIB Update

(Photo credit: Ashwini Vaishnaw on X)