TSMC holds its earnings call today, with its response closely watched amid rising industry interest in rival Intel’s advanced packaging technologies, including EMIB. In response, according to TechNews, TSMC Chairman and CEO C.C. Wei states that the company continues to offer the industry’s large...

With Tesla teaming up with Intel on the “Terafab” initiative and accelerating its push into chip manufacturing, attention in the market is turning to how TSMC will respond. At today’s earnings call, chairman C.C. Wei acknowledged that both Intel and Tesla remain TSMC customers, while also call...

Musk’s TeraFab initiative has sparked broad industry discussion, and Intel’s decision to join the project has further intensified attention. According to CRN, Intel plans to brief employees in the coming weeks on the “scope and nature” of its involvement in the TeraFab chip manufacturing pro...

Commercialization of glass substrates is accelerating, with South Korean players and Intel increasingly competing head-on for leadership. According to Global Economic, sources indicate that Intel has laid out a glass substrate roadmap targeting 2030 to secure a technological edge, while Korean firms...

On April 9, Intel Foundry Services announced a major technological breakthrough with the development of the world’s thinnest gallium nitride (GaN) chiplet. The silicon substrate has been reduced to just 19 micrometers—approx. one-fifth the diameter of a human hair. The chiplet is fabricated o...