Intel has recently disclosed a patent originally filed in 2022, revealing an IC packaging architecture that integrates Micro LEDs. The architecture features semiconductor dies embedded directly into a glass substrate, where Through-Glass-Via (TGV) within the substrate deliver power straight to th...

On September 4, Starksemi Semiconductor(Wuhan) Co., Ltd. announced the completion of a new funding round exceeding CNY 1 billion. The investment was led by CATL's Puquan Capital, with participation from Meituan Longzhu, Guotai Haitong, Youshan Capital, CDH Hong Kong, and state-owned investment platf...

During its Investor Open Day on August 28, TCL Technology detailed its strategic layout in optical communications for the first time. TCL’s management noted that the optical communications industry is on the verge of major development opportunities. The company expects to execute its roadmap fo...

Mercedes-Benz recently unveiled its mid-cycle refresh for the C-Class sedan, marking what the automaker calls the most significant technical upgrade in the model's 44-year history, with advanced lighting technology taking center stage. For the first time, the refreshed C-Class features an illumin...

The People's Government of Fujian Province recently issued the "Development Plan for Emerging and Future Industries During the 15th Five-Year Plan" (hereinafter referred to as the "Plan"). According to the Plan, by 2030, Fujian aims for strategic emerging industrial output to account for approxim...