[News] Intel Reportedly Scales EMIB Expansion in U.S., Vietnam, with Taiwanese Tool Orders Set for 2H26 Delivery

As Intel’s EMIB (Embedded Multi-die Interconnect Bridge) advanced packaging gains traction and draws strong market attention, the company is reportedly accelerating capacity expansion globally. An Investor.com report suggests Team Blue is advancing EMIB capacity expansion in parallel, with its Oregon facility in the U.S. taking the lead, while Vietnam has been positioned as another key growth hub.

The report adds that the company has already placed substantial equipment orders with Taiwanese suppliers. Beneficiaries are said to include packaging and testing equipment makers such as laser equipment supplier E&R Engineering Corp., dry-process specialist C Sun, and curing equipment provider AblePrint, with deliveries scheduled for the second half of 2026, according to Investor.com.

Intel’s leading-edge nodes, spearheaded by 18A, are gradually building momentum, while its advanced packaging portfolio is also showing clear traction. According to Wccftech, Intel’s EMIB (Embedded Multi-die Interconnect Bridge) has reached 90% yield levels, with Google and Meta Platforms emerging as potential adopters for future designs.

Vietnam as Key Expansion Hub

According to Voice of Vietnam, the chipmaker is relocating parts of its assembly, packaging, and testing operations from Costa Rica to the Saigon Hi-Tech Park (SHTP) in Ho Chi Minh City, where production will focus on chips for data center servers.

The report suggests that Intel is ramping up investment while transferring advanced packaging and testing technologies to bolster its manufacturing capacity in Vietnam. The expansion, notably, also covers processors such as Panther Lake and Wildcat Lake, both based on Intel’s cutting-edge 18A process, the report adds.

According to a 2025 Intel blog post, Intel Vietnam has evolved into a broad manufacturing hub, producing a wide range of products while advancing 3D packaging technologies across nodes from 10nm and 7nm to 18A. The site has become a key pillar of Intel’s IDM 2.0 strategy, supporting the deployment of advanced Foveros 3D packaging, scaling 5G-related products, and enabling discrete graphics solutions, the company said.

In the article, Intel noted that its Vietnam facility had, to date, produced more than 3.8 billion units, spanning a wide range of products including Lunar Lake and Arrow Lake, as well as Battlemage graphics.

Voice of Vietnam reports that Intel’s facility at the Saigon Hi-Tech Park, spanning a 46.6-hectare site, represents a total committed investment of US$4.115 billion, making up nearly 30% of the park’s overall registered capital.

Read more

• [News] Intel’s EMIB Reportedly Gains Traction at Google, Meta; Yields Said to Reach ~90% Milestone
• [News] Intel Foundry Gains Momentum: Apple Reportedly Eyes 18A-P as Google Explores Advanced Packaging

(Photo credit: Intel)