With TSMC’s CoWoS capacity remaining constrained, Intel’s EMIB (Embedded Multi-die Interconnect Bridge) advanced packaging technology is increasingly gaining traction as an alternative, fueling expectations for stronger demand across related components. Notably, ZDNet reports that Intel plans to...

As Intel gains traction with its 18A and 14A nodes, its advanced packaging business — particularly EMIB (Embedded Multi-die Interconnect Bridge) — is also drawing customer support amid tight substrate supply. Speaking at the J.P. Morgan Global Technology Conference, Intel CEO Lip-Bu Tan said sev...

As TSMC’s CoWoS capacity crunch continues, Intel’s EMIB has emerged as a strong alternative, with IC design leader MediaTek reportedly adopting a dual advanced packaging strategy. According to Commercial Times, MediaTek is accelerating its expansion into AI ASICs and data center markets, while i...

SK hynix is reportedly exploring cooperation with Intel in advanced 2.5D packaging, a move that could signal potential shifts in the AI chip packaging supply chain. According to ZDNet, sources say SK hynix is conducting R&D on Intel’s EMIB-based 2.5D packaging technology using its own HBM, whi...

As Intel’s EMIB (Embedded Multi-die Interconnect Bridge) advanced packaging gains traction and draws strong market attention, the company is reportedly accelerating capacity expansion globally. An Investor.com report suggests Team Blue is advancing EMIB capacity expansion in parallel, with its Ore...