Intel’s leading-edge nodes, spearheaded by 18A, are gradually building momentum, while its advanced packaging portfolio is also showing clear traction. According to Wccftech, Intel’s EMIB (Embedded Multi-die Interconnect Bridge) has reached 90% yield levels, with Google and Meta Platforms emergi...

TSMC holds its earnings call today, with its response closely watched amid rising industry interest in rival Intel’s advanced packaging technologies, including EMIB. In response, according to TechNews, TSMC Chairman and CEO C.C. Wei states that the company continues to offer the industry’s large...

Intel’s advanced packaging business is reportedly gaining momentum. According to Wccftech, citing WIRED, sources say the company has been in discussions with at least two major customers—Google and Amazon—on packaging services for ASIC development. This suggests both Google’s TPUs and Amazon...

As industry buzz grows over Intel’s potential role in advanced packaging for NVIDIA’s next-gen Feynman GPUs at GTC 2026, eyes are on its EMIB (Embedded Multi-die Interconnect Bridge) technology and expanding Malaysia operations. According to The Edge Malaysia, the chipmaker’s advanced packagin...

Intel is reportedly reconsidering its strategy for the 18A node. According to Reuters, Intel Chief Financial Officer David Zinsner said CEO Lip-Bu Tan is beginning to view the company’s 18A manufacturing technology as a potential offering for external customers, after it was largely positioned for...