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Optical module is an indispensable component for achieving optical communication. However, corresponding issues are becoming increasingly apparent alongside the continuously climbing usage and growing transmission performance. This report, aside from probing into the development bottlenecks of existing optical module solutions, also focuses on the dynamics of three major solutions - LPO, OBO, and CPO - and their supply chains.
Under the influence of growing AI-related demand and the slowing pace of node migration under Moore’s Law, achieving lower power consumption and higher transistor counts on a single chip has become a major challenge. To address this, 3D stacking architecture has emerged as a key technology. TSMC anticipates that within the next several years, a single chip could contain as many as 200 billion transistors. Furthermore, TSMC aims to reach a milestone of over 1 trillion transistors through 3D packaging.
As the AI chip architectures for the integration of memory and logic ICs advance from 2.5D to 3D, breakthroughs in the development of hybrid bonding will be critical. This report examines the implications of these technological advancements, focusing on the growth in the demand for hybrid bonding and related processes as well as how this trend affects equipment providers.
1. Overview of Global Memory Supply
2. Analysis of Mobile Memory Demand
3. Overview of the Smartphone Market
4. TRI’s View
As the overall performance of cloud computing resources becomes more powerful, the energy consumption and heat generated by servers are also on the rise. Data center operators now urgently seek more efficient cooling systems to control this energy consumption. This report primarily analyzes how external objective conditions drive the demand for liquid cooling solutions. Additionally, it examines the development trends of different cooling solutions and the related supply chain in Taiwan.
1. Status-quo of the Cloud AI Chip Market
2. Developments of Cloud AI Chipmakers Worldwide
3. Developments of CSPs’ Self-designed AI Chips
4. TRI’s View
1. Market Status of Cloud AI Chips
2. AI ASIC Suppliers
3. IC Design Service Providers
4. Memory IP Providers
5. TRI’s View
As international geopolitical risks rise, Apple is beginning to face the issue of supply chain relocation. Since 2000, Apple has established a complete supply chain layout in China. Before the outbreak of the epidemic, the assembly factory located in Zhengzhou of Henan provided sufficient production capacity for iPhones every year, allowing the products to be exported worldwide. However, the factory's capacity utilization rate continued to decline after the outbreak of the epidemic. In November 2022, a large-scale protest erupted due to some employees' dissatisfaction with wages and epidemic restrictions, leading to serious problems in the supply chain. Apple realized that it could no longer concentrate a large amount of production capacity on a single supplier or region, so it accelerated the relocation of its supply chain.
Demand for large panel driver ICs is set to rise sequentially throughout 2024, with ample overall supply. However, uncertainty in end-user demand has led to conservative stocking practices in the supply chain, fostering a reliance on short-term, rush orders—a practice that threatens long-term supply chain health.
In 2023, mobile TDDI chips benefited significantly from active repair and second-hand markets, resulting in annual shipments far exceeding intial forecasts. The release of lower-cost capacities by Chinese wafer foundries has helped sustain robust demand for mobile TDDIs through 2023 to 2024. Nonetheless, intense comptition in this segment has escalated price wars.
For AMOLED driver ICs, the introduction of new production capacities has boosted demand as AMOLED smartphone panel penetration increases. Currently, the market faces no-short-term supply shortages. As more suppliers enter the AMOLED DDI market, prices continue to decline. Maintaining profitability in AMOLED DDI production remains a critical challenge for IC manufacturers, especially with stable wafer prices.
1. Different Types of Automotive Main Control Chips
2. MCU
3. Cockpit SoC
4. Autonomous Driving SoC
5. TRI’s View
The anticipation of AI-Generated Content (AIGC) applications approaching large-scale commercial deployment has triggered a sharp rise in demand for AI chips, significantly impacting the global high bandwidth (HBM) market. This report will provide analysis from two fronts: First, it will explore the development of AIGC applications and large language models (LLMs). Then, it will examine the evolving needs for ASICs, GPUs, and HBM crucial for AI-powered cloud computing.