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As international geopolitical risks rise, Apple is beginning to face the issue of supply chain relocation. Since 2000, Apple has established a complete supply chain layout in China. Before the outbreak of the epidemic, the assembly factory located in Zhengzhou of Henan provided sufficient production capacity for iPhones every year, allowing the products to be exported worldwide. However, the factory's capacity utilization rate continued to decline after the outbreak of the epidemic. In November 2022, a large-scale protest erupted due to some employees' dissatisfaction with wages and epidemic restrictions, leading to serious problems in the supply chain. Apple realized that it could no longer concentrate a large amount of production capacity on a single supplier or region, so it accelerated the relocation of its supply chain.
Demand for large panel driver ICs is set to rise sequentially throughout 2024, with ample overall supply. However, uncertainty in end-user demand has led to conservative stocking practices in the supply chain, fostering a reliance on short-term, rush orders—a practice that threatens long-term supply chain health.
In 2023, mobile TDDI chips benefited significantly from active repair and second-hand markets, resulting in annual shipments far exceeding intial forecasts. The release of lower-cost capacities by Chinese wafer foundries has helped sustain robust demand for mobile TDDIs through 2023 to 2024. Nonetheless, intense comptition in this segment has escalated price wars.
For AMOLED driver ICs, the introduction of new production capacities has boosted demand as AMOLED smartphone panel penetration increases. Currently, the market faces no-short-term supply shortages. As more suppliers enter the AMOLED DDI market, prices continue to decline. Maintaining profitability in AMOLED DDI production remains a critical challenge for IC manufacturers, especially with stable wafer prices.
The anticipation of AI-Generated Content (AIGC) applications approaching large-scale commercial deployment has triggered a sharp rise in demand for AI chips, significantly impacting the global high bandwidth (HBM) market. This report will provide analysis from two fronts: First, it will explore the development of AIGC applications and large language models (LLMs). Then, it will examine the evolving needs for ASICs, GPUs, and HBM crucial for AI-powered cloud computing.
The AI chip is undoubtedly the lifebuoy of the technology industry in 2023, creating new vitality in the industry downturn. In 2024, this wave will undoubtedly continue to sweep through the industry with more services being created under Gen AI. NVIDIA, as it dominated the AI chip market in 2023, will be facing additional challenges in 2024, including whether in-house chips from the six major CSPs, such as Microsoft, Google, and Amazon, will pose as potential threats.
Chinese players, who can only purchase downgraded versions of NVIDIA chips currently, have also turned to purchasing in-house chips from China. This report will analyze which Chinese suppliers are being driven by this trend. Advanced packaging CoWoS that was regarded as a bottleneck for the capacity of AI chips throughout 2023, as well as the additional of new suppliers for 2024, will also be covered in this report.
As global internet data transmission volume continues to reach new highs, the performance bottleneck of light communication solutions becomes increasingly apparent. This report, on the one hand, explores the shortcomings of existing light communication solutions. On the other hand, it focuses on silicon photonics and CPO technology, analyzing their competitive advantages in the field of light communication, and keeping track of the development dynamics of key manufacturers.
1. Supply-side Outlook: Server DRAM and CPUs
2. Demand-side Outlook: Server Brands and CSPs
3. Server DRAM Price Trends
4. TRI's View
1. Development of Global AI Industry Chain
2. Analysis of Cross-Modal Business Opportunities in AI
3. A Breakdown of Hardware Supply Chain
4. TRI’s View
1. Global Overview of the AI Market Development
2. The Necessity of Openness in AI Development
3. Current Applications and Development of AI
4. TRI’s View
Driven by advancements in AI and Generative Content (AIGC), the role of PCs is evolving to reshape how we use technology. PCs that offer a blend of computational power, efficiency, and security are becoming the preferred environment for AI computations and machine learning, enabling personalized AI applications on a large scale. At present, AI PCs are just beginning to emerge, with their development hinging on both hardware innovation and software advancements to propel the future of AI computing forward.
Based on the application foundation of AI within the industrial field, AIGC has welcomed a robust development among industrial segments, with integration of industrial software, including CAX and EDA, in the hope of replenishing for the dislocation yielded by the innovation of process technology and AI applications. This would fully improve the substantial efficacy generated by AI, especially for fields such as visual identification and virtual reality (VR).