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The global automotive industry is accelerating innovation with a focus on EVs and autonomous driving technology, alongside software-defined vehicles. This vision of safety, efficiency, and sustainability is creating a new blue ocean for automotive sensors
As indicated by the survey of global market intelligence firm TrendForce, chip suppliers such as AMD have been actively involved in negotiations with TSMC and OSAT throughout 2Q24 on chip packaging using the FOPLP technology, with major partnership models and items shown below:
Model 1: OSATs transitioning from traditional packaging method to FOPLP when packaging consumer ICs: AMD is currently negotiating with PTI and ASE on PC CPUs, whereas Qualcomm is talking it over with ASE on PMIC. Prior to this wave of demand, MediaTek had been worked with PTI on PMIC, while Qualcomm was already a partner of ASE pertaining to PMIC.
Model 2: foundries and OSATs transitioning from 2.5D wafer level to panel level when packaging AI GPUs: AMD and NVIDIA are currently negotiating with TSMC and SPIL on packaging AI GPUs by switching from the existing 2.5D wafer level to panel level, followed by an expansion in chip packaging sizes.
Model 3: panel providers packaging consumer ICs: NXP and STMicroelectronics are negotiating with Innolux on PMIC products.
1. Global Trends in Mobile Base Station Development
2. AI Applications: Mobile Base Stations
3. TRI’s View
Optical module is an indispensable component for achieving optical communication. However, corresponding issues are becoming increasingly apparent alongside the continuously climbing usage and growing transmission performance. This report, aside from probing into the development bottlenecks of existing optical module solutions, also focuses on the dynamics of three major solutions - LPO, OBO, and CPO - and their supply chains.
Under the influence of growing AI-related demand and the slowing pace of node migration under Moore’s Law, achieving lower power consumption and higher transistor counts on a single chip has become a major challenge. To address this, 3D stacking architecture has emerged as a key technology. TSMC anticipates that within the next several years, a single chip could contain as many as 200 billion transistors. Furthermore, TSMC aims to reach a milestone of over 1 trillion transistors through 3D packaging.
As the AI chip architectures for the integration of memory and logic ICs advance from 2.5D to 3D, breakthroughs in the development of hybrid bonding will be critical. This report examines the implications of these technological advancements, focusing on the growth in the demand for hybrid bonding and related processes as well as how this trend affects equipment providers.
1. Overview of Global Memory Supply
2. Analysis of Mobile Memory Demand
3. Overview of the Smartphone Market
4. TRI’s View
As the overall performance of cloud computing resources becomes more powerful, the energy consumption and heat generated by servers are also on the rise. Data center operators now urgently seek more efficient cooling systems to control this energy consumption. This report primarily analyzes how external objective conditions drive the demand for liquid cooling solutions. Additionally, it examines the development trends of different cooling solutions and the related supply chain in Taiwan.
1. Status-quo of the Cloud AI Chip Market
2. Developments of Cloud AI Chipmakers Worldwide
3. Developments of CSPs’ Self-designed AI Chips
4. TRI’s View
1. Market Status of Cloud AI Chips
2. AI ASIC Suppliers
3. IC Design Service Providers
4. Memory IP Providers
5. TRI’s View
As international geopolitical risks rise, Apple is beginning to face the issue of supply chain relocation. Since 2000, Apple has established a complete supply chain layout in China. Before the outbreak of the epidemic, the assembly factory located in Zhengzhou of Henan provided sufficient production capacity for iPhones every year, allowing the products to be exported worldwide. However, the factory's capacity utilization rate continued to decline after the outbreak of the epidemic. In November 2022, a large-scale protest erupted due to some employees' dissatisfaction with wages and epidemic restrictions, leading to serious problems in the supply chain. Apple realized that it could no longer concentrate a large amount of production capacity on a single supplier or region, so it accelerated the relocation of its supply chain.