As power consumption and thermal density in AI servers soar, traditional air-cooling methods are increasingly inadequate when it comes to meeting the demand of high-performance computing (HPC). Liquid cooling, with its superior heat dissipation capabilities, is rapidly emerging as a key solution for supporting the next generation of high-performance systems.

The explosive growth of the AI server market has not only driven urgent demand for high-density thermal management but also transformed liquid cooling from a niche technology into a mainstream battleground—becoming a critical force behind data center upgrades.

Key Highlights

• AI server power consumption and heat density are rapidly increasing, intensifying cooling challenges.
• Traditional air-cooling methods are increasingly insufficient for high-performance computing needs.
• Liquid cooling is rising quickly due to its superior heat dissipation capabilities.
• The booming AI server market drives urgent demand for advanced high-density thermal management.
• Liquid cooling is moving from niche to mainstream, becoming a key enabler for data center upgrades.

Table of Contents

1. The Thermal Management Revolution in the AI Era: Liquid Cooling as a Strategic Enabler for HPC
   • Table 1: Comparison of NVIDIA Product Specifications
   • Figure 1: 2023–2025 Global AI Server Shipments
2. Air Cooling Reaches Its Limits as Liquid Cooling Becomes the Mainstream Solution
   • Figure 2: Overview of Two-Phase and Single-Phase Immersion Liquid Cooling
   • Figure 3: Thermal Solution Technologies vs. TDP Requirements
3. AI Liquid Cooling: Taiwan’s Strategic Supply Chain Position and Competitive Edge
   • Figure 4: Key Taiwanese Manufacturers of Critical Components for Liquid Cooling Systems
4. TRI’s View

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