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Capacity Cuts and Surging Demand for AI Power ICs Set Stage for Mature-Node Foundry Price Increases, Says TrendForce

7 May 2026

The average 8-inch capacity utilization rate among the world’s top 10 foundries is projected to approach 90% in 2026, and remain above 80% through 1H27. Foundries are reallocating 8-inch and 12-inch mature-node capacity toward power-related processes to improve ASP and profitability, benefiting Chinese foundries through order spillover. TSMC’s planned reduction in 12-inch mature-node capacity may further drive order redistribution, creating opportunities for Tier 2 foundries to raise prices.

North American AI Data Center Expansion Drives 2026 CapEx of Top Nine CSPs to US$830 Billion, Says TrendForce

6 May 2026

TrendForce’s latest findings on the AI industry highlight that several major North American CSPs have recently raised their 2026 capital expenditure (CapEx) guidance in response to strong AI demand. As a result, TrendForce has revised its forecast for the combined CapEx of the world’s top nine CSPs—Google, AWS, Meta, Microsoft, Oracle, ByteDance, Tencent, Alibaba, and Baidu—up to approximately US$830 billion in 2026, with the annual growth rate raised from 61% to 79%.

AI Optical Interconnect Boom Drives U.S. Firms to Expand Southeast Asia Outsourcing, Opening the Door for Cross-Industry Entrants, Says TrendForce

5 May 2026

Global shipment volume of optical transceivers is projected to more than triple from 26.5 million units in 2023 to over 92 million units by 2026, according to TrendForce’s latest AI infrastructure research. This massive market opportunity—combined with geopolitical factors—is driving a restructuring of the global optical communications supply chain. It is also accelerating outsourcing strategies among U.S. vendors in Southeast Asia, creating an entry point for non-traditional technology players to move into AI optical communications.

AI Competition Turns into a Supply Chain Arms Race, Tightening Advanced Packaging and 3nm Capacity, Says TrendForce

30 April 2026

TrendForce’s latest foundry industry findings point out that AI demand has surged rapidly since 2023, leading to capacity bottlenecks in 3 nm–2 nm wafers and 2.5D/3D advanced packaging. The shortage of CoWoS has persisted, extending upstream to production equipment and downstream to substrates, packaging materials, and other critical components.

Strong AI Demand vs. Weak Consumer Segment Creates Pricing Divergence Among MLCC Suppliers, Says TrendForce

28 April 2026

TrendForce’s latest research shows that the MLCC market in 2Q26 is showing a clear split between robust AI-driven demand and soft consumer demand. The U.S.–Iran conflict has pushed up oil and natural gas prices, driving higher energy and transportation costs. Consumer price indexes (CPI) across major economies rose in March, with inflation expected to intensify and weigh on end-market demand and corporate capital spending.


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