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Increased Production and Weakened Demand to Drive NAND Flash Prices Down 3–8% in 4Q24, Says TrendForce

15 October 2024

TrendForce’s latest findings reveal that NAND Flash products have been impacted by weaker-than-expected seasonal demand in the second half of 2024, leading to a decline in wafer contract prices in Q3. This downward trend is projected to deepen, with prices expected to drop by more than 10% in Q4.

Buyers Focus on Inventory Reduction; Slowing Demand Growth Constrains Q4 Memory Price Increases, Says TrendForce

9 October 2024

TrendForce’s latest findings reveal that weaker consumer demand has persisted through 3Q24, leaving AI servers as the primary driver of memory demand. This dynamic, combined with HBM production displacing conventional DRAM capacity, has led suppliers to maintain a firm stance on contract price hikes.

ODMs Slow Stocking; 4Q24 MLCC Shipments Expected to Decline by 3.6%, Says TrendForce

8 October 2024

TrendForce’s latest findings show that recent economic data points to a steady cooling of inflation in the US market, prompting the Federal Reserve to cut interest rates by 50 basis points in September to prevent a potential economic slowdown or recession. Additionally, the complex geopolitical landscape and uncertainties surrounding the US presidential election could dampen consumer spending, posing a significant risk to year-end holiday demand. Consequently, TrendForce forecasts that total shipments of MLCCs will reach approximately 1.205 trillion units in 4Q24—representing a quarterly decline of 3.6%.

HBM3e 12-Hi Faces Yield Learning Curve and Customer Validation Challenges; 2025 HBM Supply Outlook Remains Uncertain, Says TrendForce

30 September 2024

Concerns over a potential HBM oversupply in 2025 have been growing in the market. TrendForce’s Senior Vice President of Research, Avril Wu, reports that it remains uncertain whether manufacturers will be able to ramp up HBM3e production as planned next year. Additionally, the steep learning curve for achieving stable yields in HBM3e 12-Hi production makes it difficult to determine if a capacity surplus will occur.

NVIDIA Blackwell Platform and ASIC Chip Upgrades to Boost Liquid Cooling Penetration to Over 20% in 2025, Says TrendForce

23 September 2024

TrendForce’s latest reports reveal that the launch of NVIDIA’s Blackwell platform, expected in 4Q24, is set to significantly drive the adoption of liquid cooling solutions. Liquid cooling penetration is projected to grow from around 10% in 2024 to over 20% in 2025. This shift will be driven by rising global ESG awareness and the accelerated deployment of AI servers by CSPs, prompting a shift from air cooling to liquid cooling systems.


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