TrendForce’s latest report, “2027 Infrared Sensing and Optical Communication Market Trend”, shows that rapidly growing demand for data transmission in expanding data center networks is increasing interest in VCSEL-based near-packaged optics (NPO). This technology is favored for its low power usage, easier maintenance, and a mature supply chain. Major companies like Lumentum, Furukawa Electric, Coherent, Broadcom, ams OSRAM, and HiSilicon are investing heavily in R&D.
TrendForce’s latest memory industry research reveals that DRAM suppliers continue to prioritize advanced-process capacity for high-performance server products in 4Q26, keeping the overall market undersupplied. However, the pace of contract price increases is expected to moderate, with conventional DRAM prices projected to rise 10–15% QoQ.
TrendForce’s latest research reveals that continued expansion in AI server demand is keeping HBM and conventional DRAM in competition for limited advanced-process and wafer capacity. Meanwhile, yields and output for next-generation products will take time to ramp, keeping memory supply tight through 2027.
According to TrendForce, the MLCC industry is experiencing a structural shift as AI demand continues to displace traditional markets. Leading Japanese and Korean suppliers are increasingly reducing their supply of consumer-oriented MLCCs and reallocating capacity to AI-related applications. This change is opening doors for Chinese suppliers, many of whom are now undergoing MLCC qualification with global brands such as Dell, HP, ASUS, and Acer.
According to TrendForce statistics, the global DRAM module market generated $21.2 billion in revenue in 2025, up a strong 59% YoY. Rising prices and concentrated shipments from DRAM module makers in the second half of the year helped drive growth. This marked a significant acceleration from the 7% growth recorded in 2024.
