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Enterprise SSD Demand Soars While Consumer Orders Lag, Driving 3Q24 NAND Flash Revenue Up 4.8%, Says TrendForce

27 November 2024

TrendForce’s latest findings have shown that the NAND Flash industry recorded a 2% QoQ decline in bit shipments in 3Q24, but a 7% rise in ASP boosted overall revenue to US$17.6 billion—making a 4.8% QoQ increase.

Server DRAM and HBM Boost 3Q24 DRAM Industry Revenue by 13.6% QoQ, Says TrendForce

26 November 2024

TrendForce’s latest investigations reveal that the global DRAM industry revenue reached US$26.02 billion in 3Q24, marking a 13.6% QoQ increase. The rise was driven by growing demand for DDR5 and HBM in data centers, despite a decline in LPDDR4 and DDR4 shipments due to inventory reduction by Chinese smartphone brands and capacity expansion by Chinese DRAM suppliers. ASPs continued their upward trend from the previous quarter, with contract prices rising by 8% to 13%, further supported by HBM’s displacement of conventional DRAM production.

TrendForce: Unveiling New Opportunities in Tech Innovation for 2025

21 November 2024

TrendForce has outlined 10 key trends shaping the technology landscape in 2025. Highlights include:

Weak Demand Outlook and Rising Inventory and Supply Pressure DRAM Prices Down for 2025, Says TrendForce

18 November 2024

The fourth quarter is a critical period for setting DRAM contract prices. TrendForce’s latest research reveals that prices for mature DRAM processes such as DDR4 and LPDDR4X are already trending downward due to ample supply and declining demand. The demand outlook for advanced products like DDR5 and LPDDR5X remains uncertain, and with high inventory levels among certain buyers and sellers, a further drop in prices by the end of Q4 cannot be ruled out.

SK hynix Leads the Market with HBM3e 16hi Products, Boosting Capacity Limits, Says TrendForce

14 November 2024

SK hynix recently unveiled its development of HBM3e 16hi memory at the SK AI Summit 2024, featuring a 48 GB capacity per cube, with sampling scheduled for the first half of 2025. TrendForce’s latest findings reveal that this new product is aimed at applications that include CSPs’ custom ASICs and general-purpose GPUs. The 16hi HBM3e product is expected to push memory capacity limits ahead of the HBM4 generation’s launch.


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