TrendForce’s latest research into advanced semiconductor packaging reveals that GPU suppliers and hyperscale CSPs are continuing to develop increasingly powerful and versatile AI chips, making larger package sizes a key development priority for 2.5D packaging. Although TSMC’s CoWoS-L faces competition from Intel’s EMIB-T, its advantages in technology maturity and yield are expected to keep it the mainstream packaging solution for AI chips through 2028.
TrendForce’s latest AI server industry research reports that CSPs are accelerating infrastructure deployments to meet surging demand for AI applications. TrendForce estimates that global data center power demand capacity will reach 161 GW in 2026, up approximately 31% YoY. AI servers will be the primary driver of this growth, accounting for an estimated 33.4% of total demand capacity.
TrendForce’s latest memory industry research indicates that the NOR Flash market is undergoing its most significant structural shift in supply and demand in nearly a decade. AI-related products are absorbing a substantial share of production capacity, leaving suppliers limited room to increase NOR Flash bit output even as demand for high-end applications continues to grow.
According to TrendForce’s latest IC design industry research, expanding AI applications continued to drive demand for GPUs, CPUs, ASICs, and interconnect products. Consequently, combined revenue of the world’s top 10 fabless IC design companies surged 73% YoY to more than US$141.45 billion in 2Q26.
TrendForce’s latest foundry industry research reveals that the combined revenue of the world’s top 10 foundries rose 11.5% QoQ to nearly US$53.49 billion in 2Q26, setting another record high. Growth was driven by continued supply constraints for advanced processes used in AI and HPC processors, alongside rising demand for peripheral AI chips such as PMICs and power discretes. Continued advance procurement across consumer supply chains, including TVs, PCs, and notebooks, also tightened capacity for some mature processes.
