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TrendForce reports that the focus on HBM products in the DRAM industry is increasingly turning attention toward advanced packaging technologies like hybrid bonding. Major HBM manufacturers are considering whether to adopt hybrid bonding for HBM4 16hi stack products but have confirmed plans to implement this technology in the HBM5 20hi stack generation.
The latest investigations by TrendForce reveal that Chinese foundries are set to drive the bulk of mature process capacity growth in 2025, thanks to China’s domestic IC substitution policies. It is estimated that the capacity of the world’s top 10 mature process foundries will increase by 6% in 2025, though pricing pressures will persist.
TrendForce’s latest investigations reveal that the combined market share of the top five SSD module makers in the retail sector has surged from 59% in 2022 to 72% in 2023, reinforcing a trend of larger companies expanding their dominance. These major players are leveraging their scale to negotiate more favorable prices for NAND Flash, boosting their competitive edge and ensuring they have sufficient resources to stock up in preparation for market shifts.
TrendForce reports that NVIDIA has recently rebranded all its Blackwell Ultra products to the B300 series. Looking ahead to 2025, NVIDIA plans to strategically promote the B300 and GB300 lines—which utilize CoWoS-L technology—thereby boosting the demand for advanced packaging solutions.
TrendForce’s latest findings reveal that NAND Flash products have been impacted by weaker-than-expected seasonal demand in the second half of 2024, leading to a decline in wafer contract prices in Q3. This downward trend is projected to deepen, with prices expected to drop by more than 10% in Q4.