According to TrendForce, the MLCC industry is experiencing a structural shift as AI demand continues to displace traditional markets. Leading Japanese and Korean suppliers are increasingly reducing their supply of consumer-oriented MLCCs and reallocating capacity to AI-related applications. This change is opening doors for Chinese suppliers, many of whom are now undergoing MLCC qualification with global brands such as Dell, HP, ASUS, and Acer.
According to TrendForce statistics, the global DRAM module market generated $21.2 billion in revenue in 2025, up a strong 59% YoY. Rising prices and concentrated shipments from DRAM module makers in the second half of the year helped drive growth. This marked a significant acceleration from the 7% growth recorded in 2024.
U.S. CSPs have recently upgraded their enterprise SSD demand forecasts over the past two weeks, according to TrendForce’s research. This shift is mainly driven by major CSPs speeding up deployments and expanding enterprise SSD use across more applications. Notably, this demand increase isn't confined to high-performance TLC products; QLC products, known for their superior cost efficiency and capacity, have become a significant growth catalyst.
TrendForce’s latest research into advanced semiconductor packaging reveals that GPU suppliers and hyperscale CSPs are continuing to develop increasingly powerful and versatile AI chips, making larger package sizes a key development priority for 2.5D packaging. Although TSMC’s CoWoS-L faces competition from Intel’s EMIB-T, its advantages in technology maturity and yield are expected to keep it the mainstream packaging solution for AI chips through 2028.
TrendForce’s latest AI server industry research reports that CSPs are accelerating infrastructure deployments to meet surging demand for AI applications. TrendForce estimates that global data center power demand capacity will reach 161 GW in 2026, up approximately 31% YoY. AI servers will be the primary driver of this growth, accounting for an estimated 33.4% of total demand capacity.
