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TrendForce’s latest reports reveal that global NEV sales—including BEVs, PHEVs, and FCEVs—reached 4.02 million units in the first quarter of 2025, marking a 39% YoY increase. NEVs accounted for 18.4% of total global auto sales for the quarter.
TrendForce reports that leading global telecom providers such as SK Telecom and Deutsche Telekom are rolling out Agentic AI services for general users as generative AI becomes increasingly integrated into daily life in 2025. With telecom providers and major CSPs continuing to expand their data center infrastructure, Data Center Interconnect (DCI) technology is gaining significant traction. The global DCI market is projected to grow 14.3% YoY in 2025 to surpass US$40B.
TrendForce’s latest research reveals that the surge in demand for AI servers is accelerating the pace at which major US CSPs are developing in-house ASICs, with new iterations being released every one to two years. In China, the AI server market is adjusting to new US export controls introduced in April 2025, which are expected to reduce the share of imported chips (e.g., from NVIDIA and AMD) from 63% in 2024 to around 42% in 2025.
TrendForce’s latest report on the semiconductor packaging and testing (OSAT) sector reveals that the global OSAT industry in 2024 faced dual challenges from accelerating technological advancements and ongoing industry consolidation. While ASE holdings and Amkor maintained leading positions, OSAT providers from China, such as JCET and HT-Tech, saw strong double-digit revenue growth—supported by government policies and domestic demand—posing a growing challenge to the existing market order.
TrendForce’s latest research shows that weakening demand in the automotive and industrial sectors has slowed shipment growth for SiC substrates in 2024. At the same time, intensifying market competition and sharp price declines have pushed global revenue for N-type SiC substrates down 9% YoY to US$1.04 billion.
