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HBM4 Raises the Bar on Manufacturing Complexity, Premium Expected to Exceed 30%, Says TrendForce

22 May 2025

TrendForce's latest findings reveal that demand for AI servers continues to accelerate the development of HBM technologies, with the three major suppliers actively advancing their HBM4 product roadmaps.

Global NEV Sales Top 4 Million in 1Q25; BYD Remains Dual Leader, Xiaomi Enters Top 10 in BEV Segment, Says TrendForce

21 May 2025

TrendForce’s latest reports reveal that global NEV sales—including BEVs, PHEVs, and FCEVs—reached 4.02 million units in the first quarter of 2025, marking a 39% YoY increase. NEVs accounted for 18.4% of total global auto sales for the quarter.

AI Boom Drives Surge in Data Center Interconnect Demand; Global Market Value to Grow 14.3% in 2025, Says TrendForce

19 May 2025

TrendForce reports that leading global telecom providers such as SK Telecom and Deutsche Telekom are rolling out Agentic AI services for general users as generative AI becomes increasingly integrated into daily life in 2025. With telecom providers and major CSPs continuing to expand their data center infrastructure, Data Center Interconnect (DCI) technology is gaining significant traction. The global DCI market is projected to grow 14.3% YoY in 2025 to surpass US$40B.

Geopolitical Tensions Fuel a Wave of AI Chip Independence as US and Chinese CSPs Race to Develop In-House ASICs, Redefining the Market Landscape, Says TrendForce

15 May 2025

TrendForce’s latest research reveals that the surge in demand for AI servers is accelerating the pace at which major US CSPs are developing in-house ASICs, with new iterations being released every one to two years. In China, the AI server market is adjusting to new US export controls introduced in April 2025, which are expected to reduce the share of imported chips (e.g., from NVIDIA and AMD) from 63% in 2024 to around 42% in 2025.

Top 10 OSAT Companies of 2024 Revealed—China Players See Double-Digit Growth, Reshaping the Global Market Landscape, Says TrendForce

13 May 2025

TrendForce’s latest report on the semiconductor packaging and testing (OSAT) sector reveals that the global OSAT industry in 2024 faced dual challenges from accelerating technological advancements and ongoing industry consolidation. While ASE holdings and Amkor maintained leading positions, OSAT providers from China, such as JCET and HT-Tech, saw strong double-digit revenue growth—supported by government policies and domestic demand—posing a growing challenge to the existing market order.


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