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TrendForce reports that global AR device shipments are projected to reach 25.5 million units by 2030—with a CAGR of 67% from 2023 to 2030—thanks to product planning by AR brands and the advancement of AI technology and application ecosystems. Among these, the penetration of LEDoS technology is expected to rise significantly, reaching 44% by 2030, making it the mainstream technology in the market.
On August 15th, TSMC officially announced the acquisition of Innolux’s 5.5G manufacturing facility in Tainan, Taiwan, for NT$17.14 billion. TrendForce reveals that Taiwanese panel makers will still operate several smaller-generation production lines, which are historically used for IT panels and mid-to-small-sized displays. However, as competitors continue to expand their large-generation production capacities, it has become increasingly difficult for these smaller lines to compete. This challenge has prompted Taiwanese panel makers to pursue transformation strategies in recent years.
TrendForce’s latest findings reveal that the DRAM industry saw a significant revenue increase to US$22.9 billion in the second quarter of 2024—a QoQ growth of 24.8%. This surge was driven by expanded shipments of mainstream products that boosted revenue for most manufacturers. Contract prices remained on an upward trend in the second quarter, and due to geopolitical factors, the increase in conventional DRAM contract prices for the third quarter is now expected to exceed previous forecasts.
TrendForce’s latest report on enterprise SSDs reveals that a surge in demand for AI has led AI server customers to significantly increase their orders for enterprise SSDs over the past two quarters. Upstream suppliers have been accelerating process upgrades and planning for 2YY products—slated to enter mass production in 2025—in order to meet the growing demand for SSDs in AI applications.
TrendForce’s latest findings on HBM report that the HBM capacity per single chip is increasing significantly with the iteration of AI chips. Currently, NVIDIA is the largest buyer in the HBM market, and it is anticipated that NVIDIA’s procurement share in the HBM market will exceed 70% with the launch of products like Blackwell Ultra and B200A in 2025.