TrendForce’s latest research reveals that continued expansion in AI server demand is keeping HBM and conventional DRAM in competition for limited advanced-process and wafer capacity. Meanwhile, yields and output for next-generation products will take time to ramp, keeping memory supply tight through 2027.
According to TrendForce, the MLCC industry is experiencing a structural shift as AI demand continues to displace traditional markets. Leading Japanese and Korean suppliers are increasingly reducing their supply of consumer-oriented MLCCs and reallocating capacity to AI-related applications. This change is opening doors for Chinese suppliers, many of whom are now undergoing MLCC qualification with global brands such as Dell, HP, ASUS, and Acer.
According to TrendForce statistics, the global DRAM module market generated $21.2 billion in revenue in 2025, up a strong 59% YoY. Rising prices and concentrated shipments from DRAM module makers in the second half of the year helped drive growth. This marked a significant acceleration from the 7% growth recorded in 2024.
TrendForce’s latest display panel industry research reveals that surging AI demand is crowding out upstream material capacity for the panel industry, which is expected to drive total TV panel costs up 4–7% QoQ in 4Q26. Additionally, downstream customers are facing mounting cost pressure, while peak-season inventory build-up largely concluded in the third quarter. As a result, TV panel demand by unit is projected to decline 4% QoQ in 4Q26.
U.S. CSPs have recently upgraded their enterprise SSD demand forecasts over the past two weeks, according to TrendForce’s research. This shift is mainly driven by major CSPs speeding up deployments and expanding enterprise SSD use across more applications. Notably, this demand increase isn't confined to high-performance TLC products; QLC products, known for their superior cost efficiency and capacity, have become a significant growth catalyst.
