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TrendForce’s latest research on the semiconductor foundry industry reveals that advanced-node demand remained strong in 4Q25, driven by the tight supply of AI server GPUs and Google TPUs. Furthermore, the launch of new smartphones boosted wafer orders for mobile application processors (APs), supporting solid shipment performance.
NVIDIA’s next-generation AI compute rack architecture indicates that future GPU designs will increasingly prioritize higher chip-to-chip interconnect density and faster data transmission, according to TrendForce’s latest research on the high-speed interconnect market. Intra-rack chip interconnects (scale-up) and large-scale interconnects across racks (scale-out) will become central considerations in data center design as AI clusters continue to scale.
For a mainstream notebook with an MSRP of US$900, surging memory prices alone could raise retail prices by more than 30%; combined with CPU price increases, the total price hike could approach 40%. If memory and CPU prices rise simultaneously, their combined share of notebook BOM costs could climb to 58%. CPU supply volatility is also emerging, with shortages beginning to affect entry-level platforms across multiple brands.
Global smartphone production reached 337 million units in 4Q25, rising 2.7% QoQ, and was supported by strong shipments of Apple’s new iPhone lineup, according to TrendForce’s latest insights into the smartphone industry. For the full year, both Apple and Samsung each produced nearly 240 million units, tying for the top position in global smartphone production.
MacBook Neo signals Apple’s formal expansion into lower price tiers, cultivating future brand loyalty earlier. Pricing aligns with mainstream Windows notebooks, strengthening competitiveness in education procurement markets. Apple’s superior supply chain control allows it to introduce a lower-priced device despite industry headwinds.
