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Major memory suppliers continue to prioritize capacity allocation toward higher-value products such as HBM and advanced-layer 3D NAND, according to TrendForce’s latest research on the memory industry. This has squeezed the mature-node capacity for NOR Flash and SLC NAND.
TrendForce’s recent research on silicon photonics (SiPh) shows that the rapid growth of AI training and inference workloads is pushing AI data centers toward increased power use, higher rack densities, and larger clusters. As data transfer becomes a major energy drain, CSPs are treating interconnect technologies as equally important as compute hardware. The architecture of interconnects now plays a key strategic role in determining AI factory growth, energy efficiency, and supply chain management.
TrendForce's latest investigation into the foundry industry reveals that strong shipments of AI HPC chips and related components continued throughout 1Q26. Meanwhile, TV and PC/notebook supply chains accelerated production schedules and increased inventory levels for peripheral ICs, prompting foundries to receive pull-in orders and additional customer bookings.
TrendForce’s latest analysis of the enterprise SSD market reveals that rapid adoption of AI Agent services and strong procurement demand from CSPs drove enterprise SSD revenue to another record high in 1Q26. Industry revenue surged 86.1% QoQ, surpassing US$18.46 billion.
NVIDIA has decided to halve the SOCAMM memory capacity of its next-generation Vera Rubin Superchip modules, according to TrendForce’s latest findings. This adjustment does not reflect a reduction in NVIDIA’s overall memory demand. Rather, it is a response to insufficient LPDRAM capacity allocated to NVIDIA under its suppliers’ preliminary 2027 production plans.
