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TrendForce’s latest research shows that significant increases in conventional DRAM contract prices, higher bit shipments, and growing HBM volumes drove the global DRAM industry revenue to US$41.4 billion in 3Q25, marking a strong 30.9% QoQ growth.
TrendForce’s latest report, “2025 Near-Eye Display Market Trend and Technology Analysis,” reveals that the rapid expansion of AR strategies by leading brands such as Meta, Apple, Amazon, and RayNeo is speeding up across various display technologies. LEDoS and LCoS are emerging as the fastest-growing segments, with projected 2025 penetration rates of 37% and 7%, respectively, and expected to increase to 65% and 11% by 2030.
TrendForce’s latest investigations reveal that the rapid expansion of AI and HPC is increasing the need for heterogeneous integration, positioning advanced packaging as a strategic priority. TSMC’s CoWoS platform is currently the leading solution in this area. However, as CSPs accelerate their in-house ASIC development to accommodate more complex functions, their packaging size requirements are growing substantially. As a result, some CSPs are contemplating a switch from TSMC’s CoWoS to Intel’s EMIB.
TrendForce’s latest investigations reveal that global NEV sales hit 5.39 million units in the third quarter of 2025, showing a 31% YoY growth. BEVs made up 3.71 million units, with a notable 48% YoY growth, while PHEVs reached 1.67 million units, marking a 4% increase year over year.
TrendForce’s latest research points out that AI server design is undergoing a fundamental structural shift. From NVIDIA’s Rubin platform featuring a fully cableless architecture, to hyperscalers’ in-house ASIC servers adopting ultra-high-layer HDI designs, PCBs are no longer merely passive circuit carriers—they are becoming a core enabler of compute performance. The PCB industry is officially entering an era defined by high frequency, high power, and high density.
