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Tight DRAM Supply to Boost DDR5 Contract Prices—Profitability in 2026 Expected to Surpass HBM3e, Says TrendForce

29 October 2025

TrendForce’s latest investigations show that server DRAM contract prices are strengthening in 4Q25, driven by ongoing data center expansion among global CSPs. This momentum is lifting overall DRAM pricing. Although final contract pricing for the quarter is still being negotiated, suppliers are showing a greater willingness to raise quotes as CSPs increase order volumes.

Large-Generation OLED Competition Heats Up in the IT Market—FMM leads as FMM-Free Accelerates, Says TrendForce

28 October 2025

Recently, TCL CSOT began constructing its t8 Gen 8.6 OLED factory, marking the start of large-scale global investments in IT OLED panel production. TrendForce reports that Samsung Display (SDC) continues to lead by making the earliest investments in Gen 8.6 OLED capacity. Meanwhile, Chinese manufacturers like BOE, Visionox, and TCL CSOT are also progressing with their own Gen 8.6 OLED manufacturing plans.

4Q25 holiday Demand May Weaken as Polarization of MLCC Supply Intensifies, Says TrendForce

21 October 2025

TrendForce’s latest MLCC investigation reveals growing macroeconomic headwinds. The U.S. ADP September Employment Report recorded its largest decline in two and a half years, while the Federal Reserve was left without key data for policy decisions due to the government shutdown.

Supply Chain and Application Breakthroughs to Drive OLEDoS Penetration in VR/MR to 58% by 2030, Says TrendForce

20 October 2025

Apple is making a notable comeback in the VR/MR market with its upgraded Vision Pro, which still uses OLEDoS display panels. The device aims to drive the next generation of head-mounted devices by enhancing computing power and weight distribution.

2H25 Foundry Utilization Exceeds Expectations, Some Players Are Prepared for Price Hikes, Says TrendForce

15 October 2025

TrendForce’s latest investigations have revealed that wafer foundry utilization during the second half of 2025 has remained more resilient than anticipated. Several factors are contributing to this, including the postponed U.S. semiconductor tariffs, low inventory at IC vendors, the peak smartphone season, and ongoing high demand for AI. These conditions have prevented the expected decline in capacity utilization.


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