Press Center

Press Releases




Global EV Traction Inverter Installations Remain Resilient in 1Q26 Despite Seasonal Slowdown; High-Voltage Architectures Emerge as Key Growth Driver, Says TrendForce

23 June 2026

TrendForce's recent report on EV traction inverters shows that in the first quarter of 2026—usually the industry's slowest season—global installations hit around 6.82 million units, a 1.9% increase from 6.69 million units in the same period of 2025. These figures suggest that the electrification push continues strongly despite lower seasonal demand, highlighting the EV market's resilience.

Consumer DRAM Shortages Extend to DDR2 Products with Contract Prices Expected to Continue Rising in 3Q26

22 June 2026

TrendForce’s latest research reveals that structural tightening in mature-node DRAM supply is forcing consumer DRAM buyers to adopt legacy memory products to secure larger supply allocations. This has triggered a new wave of demand for procuring older-generation DRAM components, driving continued price momentum across legacy products such as DDR2 and DDR3.

TCL CSOT’s IJP OLED to Enter Branded Monitor and Notebook Products in 2H26, Challenging Korean Dominance, Says TrendForce

18 June 2026

TCL CSOT is aggressively promoting inkjet-printed OLED (IJP OLED) technology as a means of entering the OLED monitor and notebook panel supply chain, according to TrendForce’s findings. Its Gen 5.5 IJP OLED production line has already reached volume production and successfully commercialized medical display panels, while validation programs for branded monitor and notebook products are currently underway. The company’s progress could potentially challenge the long-standing dominance of Korean panel makers in the OLED industry.

TSMC Accelerates CoPoS Development; Taiwan Panel Makers and Local Materials and Equipment Suppliers Leverage FOPLP for Glass Core Substrate Opportunity, Says TrendForce

17 June 2026

The rapid growth of demand for AI semiconductors is driving the evolution of advanced packaging technologies, with Fan-Out Panel-Level Packaging (FOPLP) emerging as a new battleground across the industry. TrendForce reports that TSMC is currently focusing on its Chip-on-Panel-on-Substrate (CoPoS) packaging architecture and has standardized on a 310 × 310 mm panel format.

CSP In-House ASIC Boom Drives MLCC Specification Concentration; Structural Shortages of High-End Specialty MLCCs May Emerge in 2H26, Says TrendForce

17 June 2026

According to TrendForce’s latest MLCC industry research, the ongoing AI arms race among global CSPs is accelerating the adoption of in-house ASIC accelerators, which increasingly rely on small-form-factor, high-capacitance, high-temperature-resistant MLCCs. As such, demand is rapidly concentrating on a limited number of premium specifications. However, with supplier capacity expansion lagging behind demand growth, the risk of structural shortages in the second half of 2026 is becoming increasingly difficult to ignore.


  • Page 1
  • 827 page(s)
  • 4134 result(s)


Get in touch with us


Get in touch with us