According to TrendForce, the MLCC industry is experiencing a structural shift as AI demand continues to displace traditional markets. Leading Japanese and Korean suppliers are increasingly reducing their supply of consumer-oriented MLCCs and reallocating capacity to AI-related applications. This change is opening doors for Chinese suppliers, many of whom are now undergoing MLCC qualification with global brands such as Dell, HP, ASUS, and Acer.
According to TrendForce statistics, the global DRAM module market generated $21.2 billion in revenue in 2025, up a strong 59% YoY. Rising prices and concentrated shipments from DRAM module makers in the second half of the year helped drive growth. This marked a significant acceleration from the 7% growth recorded in 2024.
TrendForce’s latest display panel industry research reveals that surging AI demand is crowding out upstream material capacity for the panel industry, which is expected to drive total TV panel costs up 4–7% QoQ in 4Q26. Additionally, downstream customers are facing mounting cost pressure, while peak-season inventory build-up largely concluded in the third quarter. As a result, TV panel demand by unit is projected to decline 4% QoQ in 4Q26.
U.S. CSPs have recently upgraded their enterprise SSD demand forecasts over the past two weeks, according to TrendForce’s research. This shift is mainly driven by major CSPs speeding up deployments and expanding enterprise SSD use across more applications. Notably, this demand increase isn't confined to high-performance TLC products; QLC products, known for their superior cost efficiency and capacity, have become a significant growth catalyst.
TrendForce’s latest research into advanced semiconductor packaging reveals that GPU suppliers and hyperscale CSPs are continuing to develop increasingly powerful and versatile AI chips, making larger package sizes a key development priority for 2.5D packaging. Although TSMC’s CoWoS-L faces competition from Intel’s EMIB-T, its advantages in technology maturity and yield are expected to keep it the mainstream packaging solution for AI chips through 2028.
