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1Q26 conventional DRAM contract prices raised to +90–95% QoQ; NAND Flash to +55–60% QoQ. CSPs, server OEMs, and PC OEMs broadly face DRAM supply gaps; PC DRAM prices are expected to at least double QoQ in 1Q26. Strong North American CSP demand lifts enterprise SSD orders; prices projected to rise 53–58% QoQ in 1Q26.
TrendForce’s latest research indicates that AI innovation is causing a fundamental shift in the memory market. As data access volumes continue to grow, AI systems depend more on high-bandwidth, high-capacity, low-latency DRAM to handle large-scale model parameters, long-sequence inference, and multi-task parallel processing. Additionally, NAND Flash has become essential for fast data transfer, making memory a key component in AI infrastructure and a strategic focus for CSPs.
North American CSPs' continued investments in AI infrastructure are expected to increase global AI server shipments by more than 28% YoY in 2026, according to the latest market research from TrendForce. The rapid growth of AI inference services is boosting demand for general-purpose servers, supporting both replacement and expansion efforts. Consequently, TrendForce predicts that total global server shipments, including AI servers, will accelerate from 2025, with a 12.8% YoY growth in 2026.
TrendForce’s latest DRAM industry survey reveals that Micron intends to acquire PSMC’s Tongluo fab in Taiwan (excluding production equipment) for US$1.8 billion. The deal also includes a long-term partnership for future DRAM packaging services. This collaboration aims to enable Micron to increase its capacity for advanced-node DRAM while boosting PSMC’s supply of mature-node DRAM, potentially improving the global DRAM supply outlook by 2027.
TSMC and Samsung are cutting 8-inch wafer capacity, pushing global 8-inch capacity to a projected 2.4% year-over-year decline in 2026. AI-driven demand for power ICs is becoming the key pillar supporting 8-inch fab utilization throughout the year. Foundries are considering price hikes of 5-20%, though weak end-market visibility and cost pressure from rising memory and advanced-node prices may cap actual increases.
