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According to recent media reports, the U.S. Federal Communications Commission (FCC) is drafting a proposal that would expand its Covered List to restrict imports of new-model optical transceivers manufactured in China. TrendForce notes that since the proposal has not yet been officially released, several key issues remain unclear, including the definition of “new models,” the criteria for determining “Chinese manufacturers” (e.g., company nationality, inclusion on the Covered List, or manufacturing location), and whether any transition period will be provided. Therefore, it is believed to be too early to interpret the proposal as a comprehensive ban on Chinese optical transceivers.
According to TrendForce's latest memory industry research, DRAM supply will remain tight through 2027, and uncertainty persists over memory suppliers' HBM4e validation timelines. Together, these constraints are prompting AI chip vendors to scale back the HBM configurations of their next-generation products.
Surging investment in AI infrastructure is expected to drive the combined CapEx of the world’s nine largest CSPs up by approximately 90% YoY in 2026, according to TrendForce’s latest AI server research.
TrendForce’s latest research on the memory industry reveals that AI will remain the primary driver of memory demand in 2027. However, market dynamics are expected to diverge between DRAM and NAND Flash.
According to TrendForce’s latest MLCC industry survey, robust AI demand drove June 2026 shipments from the top three Japanese and Korean suppliers—Murata, Samsung Electro-Mechanics (SEMCO), and Taiyo Yuden—to a five-year monthly high. Concurrently, a sustained spillover of consumer-grade MLCC orders is benefiting distribution channels and suppliers in Taiwan and mainland China, thereby driving up their quotes.
