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TrendForce’s latest research shows that significant increases in conventional DRAM contract prices, higher bit shipments, and growing HBM volumes drove the global DRAM industry revenue to US$41.4 billion in 3Q25, marking a strong 30.9% QoQ growth.
TrendForce’s latest investigations reveal that the rapid expansion of AI and HPC is increasing the need for heterogeneous integration, positioning advanced packaging as a strategic priority. TSMC’s CoWoS platform is currently the leading solution in this area. However, as CSPs accelerate their in-house ASIC development to accommodate more complex functions, their packaging size requirements are growing substantially. As a result, some CSPs are contemplating a switch from TSMC’s CoWoS to Intel’s EMIB.
TrendForce’s latest research points out that AI server design is undergoing a fundamental structural shift. From NVIDIA’s Rubin platform featuring a fully cableless architecture, to hyperscalers’ in-house ASIC servers adopting ultra-high-layer HDI designs, PCBs are no longer merely passive circuit carriers—they are becoming a core enabler of compute performance. The PCB industry is officially entering an era defined by high frequency, high power, and high density.
Trendforce’s latest investigations reveal that the global macroeconomic outlook for 2026 remains weak, with geopolitical tensions and ongoing inflation continuing to dampen consumer demand. Notably, the memory industry has begun a robust upward pricing cycle, increasing overall system costs. This forces downstream brands to hike retail prices, which adds pressure on the consumer market.
TrendForce’s latest investigations reveal that despite higher ASPs boosting profitability across the memory industry, capital spending on DRAM and NAND Flash is only anticipated to increase modestly in 2026. This limited investment growth is unlikely to significantly affect bit output. Instead, the emphasis is shifting from capacity expansion to advancements such as process technology upgrades, higher-layer stacking, hybrid bonding, and high-value products such as HBM.
