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Q2 NAND Flash Contract Prices Expected to Rise by 13–18%, Enterprise SSDs to See Highest Increase, Says TrendForce

28 March 2024

TrendForce projects a strong 13–18% increase in Q2 NAND Flash contract prices, with enterprise SSDs expected to rise highest. Despite Kioxia and WDC boosting their production capacity utilization rates from Q1 this year, other suppliers have kept their production strategies conservative.

Suppliers Aim to Raise Contract Prices, But With Uncertain Demand, 2Q24 DRAM Price Increase Expected to Narrow to 3–8%, Says TrendForce

26 March 2024

Additionally, significant price increases by suppliers since 4Q23 are expected to further diminish the momentum for inventory restocking. As a result, DRAM contract prices for the second quarter are projected to see a modest increase of 3–8%, says TrendForce.

Kioxia and WD Elevate Capacity Utilization, Pushing NAND Flash Supply Growth to 10.9%, Says TrendForce

19 March 2024

TrendForce reports that anticipation of NAND Flash price hikes into Q2 has motivated certain suppliers to minimize losses and lower costs in hopes of returning to profitability this year. Kioxia and WD led the charge from March, boosting their capacity utilization rates to nearly 90%—a move not widely adopted by their competitors.

2024 HBM Supply Bit Growth Estimated to Reach 260%, Making Up 14% of DRAM Industry, Says TrendForce

18 March 2024

TrendForce reports that significant capital investments have occurred in the memory sector due to the high ASP and profitability of HBM. Senior Vice President Avril Wu notes that by the end of 2024, the DRAM industry is expected to allocate approximately 250K/m (14%) of total capacity to producing HBM TSV, with an estimated annual supply bit growth of around 260%. Additionally, HBM’s revenue share within the DRAM industry—around 8.4% in 2023—is projected to increase to 20.1% by the end of 2024.

HBM3 Initially Exclusively Supplied by SK Hynix, Samsung Rallies Fast After AMD Validation, Says TrendForce

13 March 2024

TrendForce highlights the current landscape of the HBM market, which as of early 2024, is primarily focused on HBM3. NVIDIA’s upcoming B100 or H200 models will incorporate advanced HBM3e, signaling the next step in memory technology. The challenge, however, is the supply bottleneck caused by both CoWoS packaging constraints and the inherently long production cycle of HBM—extending the timeline from wafer initiation to the final product beyond two quarters.


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