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NVIDIA and Broadcom Begin Volume Ramp of CPO Switches, with Optical Engine Yield and Advanced Packaging Capacity Emerging as Key Expansion Bottlenecks, Says TrendForce

27 July 2026

TrendForce's latest research on the optical communications industry reveals that NVIDIA has begun shipping its next-generation Spectrum-X CPO switch to select partners. Meanwhile, Broadcom is continuing limited shipments of its 51.2T Bailly CPO switch, marking the official transition of co-packaged optics (CPO) into the mass production phase.

NAND Flash Supply Growth to Outpace Demand in 2027, Easing Supply Constraints in 2H27, Says TrendForce

21 July 2026

TrendForce’s monthly July NAND Flash update reveals that the NAND Flash market has remained undersupplied throughout 2026, driven by surging AI-related demand and limited capacity expansion.

Niche Demand and MLC Migration to Drive SLC NAND Prices up 120–170% in 2H26, Says TrendForce

13 July 2026

TrendForce's recent memory pricing survey shows that more mature NAND process capacity is being shifted toward higher-value products like high-layer-count 3D NAND, leading to a significant shortage of MLC NAND supply. As a result, some industrial, automotive, and networking clients are considering switching to SLC NAND, further tightening the already limited market.

Long-Term Agreements Cap Price Increases; Server DRAM Contract Prices Expected to Rise 13-18% QoQ in 3Q26, Says TrendForce

9 July 2026

TrendForce’s latest memory pricing survey indicates that multiple memory suppliers have already factored in expected price hikes into their prices for the second quarter of 2026. Additionally, several U.S.-based CSPs have entered into multi-year long-term agreements (LTAs), which restrict suppliers from raising prices for these clients.

AI Demand for High-End MLCCs Drives Japan and Korea Suppliers’ Book-to-Bill Ratios to Post-Pandemic Highs, Raising Shortage Risks in 2H26, Says TrendForce

6 July 2026

TrendForce's latest MLCC industry research indicates that accelerating AI server platform upgrades and the continued volume growth of custom ASICs developed by CSPs have significantly boosted demand for high-end MLCCs.


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