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Despite Export Ban on Equipment, China’s Semiconductor Expansion in Mature Processes Remains Strong, Says TrendForce

5 July 2023

TrendForce anticipates the market share of Chinese foundries in terms of 12-inch wafer production capacity will likely increase from 24% in 2022 to an estimated 26% in 2026. Moreover, if the exports of 40/28nm equipment eventually receive approval, there’s a chance that this market share could expand even further, possibly reaching 28% by 2026. This growth potential should not be dismissed.

TrendForce:2023 SiC Power Device Market Analysis Report

5 July 2023

TrendForce:2023 SiC Power Device Market Analysis Report

DRAM ASP Decline Narrows to 0~5% for 3Q23 Owing to Production Cuts and Seasonal Demand, Says TrendForce

5 July 2023

TrendForce reports that continued production cuts by DRAM suppliers have led to a gradual quarterly decrease in overall DRAM supply. Seasonal demand, on the other hand, is helping to mitigate inventory pressure on suppliers. TrendForce projects that the third quarter will see the ASP for DRAM converging towards a 0~5% decline.

AI and HPC Demand Set to Boost HBM Volume by Almost 60% in 2023, Says TrendForce

28 June 2023

TrendForce forecasts that global demand for HBM will experience almost 60% growth annually in 2023, reaching 290 million GB, with a further 30% growth in 2024.

Major CSPs Aggressively Constructing AI Servers and Boosting Demand for AI Chips and HBM, Advanced Packaging Capacity Forecasted to Surge 30~40% by 2024, Says TrendForce

21 June 2023

TrendForce highlights that to augment the computational efficiency of AI servers and enhance memory transmission bandwidth, leading AI chip makers such as Nvidia, AMD, and Intel have opted to incorporate HBM. Presently, Nvidia’s A100 and H100 chips each boast up to 80 GB of HBM2e and HBM3.

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