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Memory Price Surge Squeezes Game Console Margins; 2026 Shipment Forecast Revised Downward, Says TrendForce

2 December 2025

TrendForce’s latest report states that rising memory prices have significantly increased BOM costs in consumer electronics, leading brands to hike retail prices and dampening market demand. After reducing its 2026 shipment forecasts for smartphones and laptops earlier in November, TrendForce has also downgraded its 2026 forecast for game console shipments—from an initial YoY decline of 3.5% to 4.4%.

NAND Flash Wafer Supply Tightens Further, Some Products See Over 60% Contract Price Hikes in November, Says TrendForce

1 December 2025

TrendForce’s latest research shows that demand for NAND Flash stayed strong in November 2025, fueled by AI applications and solid enterprise SSD orders. Meanwhile, suppliers continued to focus on capacity for high-margin enterprise and premium products, while old-node capacity was quickly phased out.

AI to Reshape the Global Technology Landscape in 2026, Says TrendForce

27 November 2025

TrendForce has identified 10 key technology trends that will define the tech industry's evolution in 2026. The highlights of these findings are outlined below:

Global DRAM Revenue Jumps 30.9% in 3Q25, Micron’s Market Share Climbs by 3.7 Percentage Points, Says TrendForce

26 November 2025

TrendForce’s latest research shows that significant increases in conventional DRAM contract prices, higher bit shipments, and growing HBM volumes drove the global DRAM industry revenue to US$41.4 billion in 3Q25, marking a strong 30.9% QoQ growth.

AI Boom Drives Demand for Ultra-Large Packaging as ASICs Expected to Shift from CoWoS to EMIB, Says TrendForce

25 November 2025

TrendForce’s latest investigations reveal that the rapid expansion of AI and HPC is increasing the need for heterogeneous integration, positioning advanced packaging as a strategic priority. TSMC’s CoWoS platform is currently the leading solution in this area. However, as CSPs accelerate their in-house ASIC development to accommodate more complex functions, their packaging size requirements are growing substantially. As a result, some CSPs are contemplating a switch from TSMC’s CoWoS to Intel’s EMIB.


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