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At the start of the first quarter of 2017, contract prices of server DRAM modules have already increased by over 25% on average from the same point in the prior quarter, according to the latest report by DRAMeXchange, a division of TrendForce. The sequential contract price increases for some high-density server DRAM modules are even at nearly 30%. The average worldwide contract price of DDR4 R-DIMM 32GB modules has broken through the threshold of US$200, while the 16GB counterparts have also climbed to about US$100.
The LED chip subsidiary of China’s major LED supplier San’an Optoelectronics has just announced an 8% price hike for some its products that will take effect on January 10, 2017. Following four major waves of price increases implemented by participants in the global LED industry during 2016, San’an Opto is now leading another major price adjustment at the start of 2017. LEDinside, a division of TrendForce, believes that the main factor behind these price hikes is the rising costs of raw materials in the upstream of the supply chain, while warming demand and extremely low quotes also made the price increases more noticeable. LEDinside furthermore expects the material and manufacturing costs will play a central role in the pricing among industry players.
The latest analysis by DRAMeXchange, a division of TrendForce, finds that average selling prices of various categories of DRAM products will increase significantly in the first quarter of 2017 as they continue to experience tight supply. The general price upswing that began in the second half of 2016 therefore will persist into the first quarter of this year despite the period being the traditional off-peak season. The contract prices of DDR3 4GB PC DRAM modules have reached a high of above US$25, and prices of DRAM products will see an estimated sequential quarterly increase of more than 30% on average, which would be a new record for the off-peak season.
The latest research on touch display solutions by WitsView, a division of TrendForce, finds that the share of In-Cell products in the global smartphone display market will expand to 29.6% by the end of 2017. The recent rapid adoption of In-Cell solutions among panel makers is due to the increase in the supply of IC components related to Touch with Display Driver Integration (TDDI).
The global NAND Flash industry will see an annual increase of just 6% in its total wafer capacity in 2017, according to analysis by DRAMeXchange, a division of TrendForce. As the pace of the industry-wide transition to 3D-NAND architecture accelerates, supply of 2D-NAND memory will drop sharply, leading to shortages next year. Furthermore, many suppliers are still working on the mass production of 3D-NAND memory. Until the industry in general is able to apply 64-layer 3D-NAND solutions to OEM storage products, the market supply for 3D-NAND memory will remain tight. In the meantime, NAND Flash prices will continue to go up and boost suppliers’ revenues.
